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System Chip Software Engineer

Job in Alameda, Alameda County, California, 94501, USA
Listing for: Science
Full Time position
Listed on 2026-08-28
Job specializations:
  • Software Development
    Unix/Linux, Embedded Systems/ Firmware/ IoT, Embedded Software Engineer
Salary/Wage Range or Industry Benchmark: 130000 - 200000 USD Yearly USD 130000.00 200000.00 YEAR
Job Description & How to Apply Below
Position: System on Chip Software Engineer

Science is a clinical stage, vertically integrated technology company focused on solving some of neuroscience’s hardest questions and most serious unmet medical needs. We work to restore quality of life to those with debilitating conditions for which there are no treatment options, creating devices aimed at restoring vision, cognition, and mobility to patients who have lost it. To support progress across our industry, we provide state-of-the-art components and vertically integrated infrastructure for others to build on via Science Foundry.

We are seeking a SoC Software Engineer to own the platform layers for medical wearables. This is silicon‑up work: taking custom hardware from first power‑on to a stable, characterised platform the application team can build on. You'll integrate vendor BSPs into our build system, bring up display, camera, audio, and connectivity subsystems on novel boards, and partner closely with EE on bench‑level debug when the failure crosses the hardware/software line.

The role suits someone comfortable with an oscilloscope on the bench and a kernel log open on the other monitor.

Boot, BSP & Build Infrastructure
  • Own the SoC BSP integration pipeline: boot loader, firmware, kernel, and userspace builds
  • First boot on custom hardware: device tree development, PMIC configuration, power sequencing, flash procedure development
  • Maintain build environments, patch systems, kernel config management
  • Debug boot failures at every stage: boot loader stages, kernel init, userspace
Peripheral Bringup & Integration
  • Display: MIPI DSI panel driver bringup, init sequences, timing, display subsystem configuration
  • Camera: sensor driver bringup (MIPI CSI), ISP pipeline configuration and optimisation
  • Audio: codec bringup, digital and analogue mic path configuration, mixer/DAPM routing
  • Connectivity:
    Bluetooth and WiFi firmware loading and configuration
  • IMU and other sensor bringup (I2C/SPI integration)
Power & Performance
  • Platform power measurement and optimisation: CPU tuning, peripheral power profiling, regulator management
  • Battery/charger configuration, suspend/resume, peripheral power gating
  • PMIC debug: LDO/SMPS configuration, fault analysis
Characterisation, Reliability & Production Readiness
  • Reliability testing: long‑duration soak tests, suspend/resume cycling, subsystem crash recovery, watchdog validation
  • Secure boot chain, verified boot, SELinux policy configuration
  • OTA update infrastructure, factory provisioning, production test support
  • Platform characterisation: thermal profiling, power consumption across operating modes, sustained‑workload stress testing
Cross-Functional Debug
  • Systematic failure triage: reading crash dumps, correlating timestamps across subsystems, bisecting regressions across BSP and kernel versions
  • Board-level debug in collaboration with EE team: correlating software behaviour with bench measurements, power rail issues, fault isolation
Key Qualifications
  • 5+ years of embedded Linux development with significant hands‑on SoC platform bringup experience
  • Direct experience bringing up custom hardware from a vendor BSP: boot loader, device tree, kernel drivers, flash procedures
  • Deep familiarity with multiple SoC subsystems: PMIC, audio codec, connectivity, display, camera
  • Kernel driver development and debugging, meaning reading and modifying driver source
  • Comfortable with bench‑level debug: UART consoles, JTAG, oscilloscopes, logic analyzers
  • Strong understanding of common embedded interfaces: MIPI DSI/CSI, I2C, SPI, SPMI, Sound Wire or similar
Preferred Qualifications
  • Qualcomm SoC experience is strongly preferred: chipcode/BSP integration, CamX/CHI camera pipeline, SDE/MDSS display, Sound Wire audio, XBL boot, CDT, DTBO
  • Experience shipping a product on custom hardware with custom device trees, custom drivers, and production builds (not just eval board work)
  • Both Android (AOSP) and Linux (Ubuntu/Yocto) BSP experience
  • Camera ISP pipeline depth: topology, sensor driver integration, pipeline optimisation
  • Medical device software experience (IEC 62304)
  • FPGA/ co‑processor integration
Salary/Pay Range

For individuals hired to work in California, Science Corporation is required by law to include a reasonable estimate of…

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