Process Integration Engineer

About Applied Materials

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting‑edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day.

Salary range: $ - $

Location:

Albany, NY & Santa Clara, CA

Benefits include a supportive work culture, professional growth programs, and comprehensive health and wellness resources.

• Develop new modules leveraging Applied’s equipment portfolio and advise the Packaging Business Unit on equipment requirements for advanced semiconductor packaging.
• File for IP on patentable developments.
• Provide domain expertise in advanced packaging areas such as W2W/D2W bonding, micro‑bumps, TSV, thermal management, optics, and multi‑wafer stacking.
• Drive new materials and process development to enable performance inflections in logic, DRAM, and NAND using structured problem‑solving methodology.
• Demonstrate a proven track record of solving complex problems through innovation and novel approaches.
• Act as a semiconductor packaging engineering expert and lead cross‑functional projects with engineers, managers, and directors across Applied’s business units.
• Help structure and maintain Applied’s packaging roadmap and its alignment with industry modules.
• Design experiments to improve packaging wiring performance by reducing RC delays and increasing wiring density using advanced dielectrics.
• Represent Integration Module Solutions (IMS) as a module specialist to internal business units and external customers.
• Define engineering plans, design design of experiments (DOE), characterize results, and produce engineering reports for advanced packaging.
• Create roadmap committees for packaging applications and shepherd Applied’s product portfolio.
• Lead projects across the organization in a fast‑paced environment.
• Be a self‑starter, team player, and able to work independently with minimal supervision.

• BS or MS in Electrical, Mechanical, Material Engineering or equivalent.
• Minimum 10 years of experience in semiconductor packaging development and manufacturing.
• Strong communication skills for effective interaction with business units, cross‑functional teams, internal and external manufacturing, and customers.
• Deep understanding of materials, process, device physics, and integration in advanced packaging.
• Strong problem‑solving skills and experience with innovative engineering solutions.

• Apply broad industry and commercial awareness to drive financial and operational performance across business units and departments.

• Lead through influence, knowledge, and connections; work with managers inside and outside the immediate business unit; implement segment/functional plans and contribute to strategic development.

• Direct resolution of highly complex or unusual business problems using advanced analytical thought and judgement.

• Guide segment/functional strategy and impact results across departments, business units, or sub‑functions by providing support that drives business outcomes.

• Negotiate and influence opinions at senior executive levels and external organizations; exercise sensitivity to audience.

Time Type:
Full time
Employee Type:
Assignee / Regular
Travel:
Yes, 20% of the time
Relocation Eligible:
Yes

Position requires understanding and adherence to Applied Materials global Standards of Business Conduct and compliance at all times.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.