Process Integration Engineer

** Who We Are*
* Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

** What We Offer*
* Salary:

$ - $

Location:

Albany,NY

You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits () .

We are seeking a skilled and experienced Process Integration Engineer to join our Photonics Platform Business Group with a focus on the area of optical interconnect and co-packaged optics. This position is in Applied Materials META Center at Albany, NY. As a Process Integration Engineer, you will be responsible of developing and optimizing process flows of optical and photonics devices as owner.

You are expected to be highly detail-oriented and sharp minded in risk identification and mitigation. You will also be the first respondent of the device test and characterizations to drive flow iterations to improve the performance, yield, and reliability. You will work closely with cross-functional teams, including design, process, and equipment engineers, to drive continuous improvement and ensure seamless integration of processes throughout the development and manufacturing lifecycle.

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* Key Responsibilities:

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* · Own, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.

· Interface with partner foundries to define, start, and drive JDPs to completion at high pace.

· Develop, optimize, and own process flows, ensuring the highest level of product performance, yield, and reliability.

· Collaborate with design, process, and equipment engineers to define and implement process integration strategies and methodologies.

· Manage integration lots across multiple sites.

· Collect on-wafer data, perform analysis, and provide outcome, learnings and plan for fast learning cycles.

· Stay updated with the latest advancements, industry trends, and competitor status and apply knowledge to drive innovations.

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* Basic Qualifications:

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* · Master or PhD degree in Electrical Engineering, Materials Science, Physics or a related field;  Ph.D preferred.

· 7-10 years of work experience in semiconductor processing. Proven experience in process integration, preferably R&D within a high-volume manufacturing foundry environment.

· Deep knowledge of semiconductor module processes used in FEOL transistors and BEOL interconnect, including lithography, etch, deposition, electroplating, CMP, wet clean, inline and failure analysis metrology.

· Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP).

· Strong communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams.

· Detail-oriented and organized, with the ability to manage multiple projects and priorities simultaneously.

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* Preferred Qualifications:

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* · Direct experience of managing or working with foundry PDKs, from VLSI layout design, DRC, LVS, to photomask tape-out procedure is a plus.

· Direct experience of BEOL Cu interconnect e-test and reliability test is a plus.

· Knowledge of…