Dry Etch Process Develop Engineer

About the Role

As a Dry Etch Process Engineer you will develop, integrate, and optimize plasma etch processes that enable next-generation memory devices. You will work hands‑on with etch equipment, chamber hardware, consumables, and metrology, using data‑driven methods to improve critical dimension control, profile, selectivity, uniformity, and defect performance. You will collaborate closely with integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes from R&D into high-volume manufacturing.

• Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch).
• Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness.
• Drive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.
• Perform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.
• Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.
• Document process baselines, change controls, and learning; communicate results and support technology transfer to high‑volume manufacturing.

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related field relevant to plasma processing and semiconductor manufacturing.
• B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch will also be considered.
• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Ability to collaborate effectively across cross‑functional technical teams and communicate results clearly.

• Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization techniques and tool health monitoring methodologies.
• Experience working with semiconductor equipment vendors, joint development programs, or R&D environments.
• Familiarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.

Semiconductor Process Engineer 4

Relocation Level: TBD

US base salary range: $107,000 – $182,000 per year.

Micron offers medical, dental, vision plans, income protection, paid family leave, paid time off, and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.

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To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  or 1‑800‑336‑8918 (select option #3).