Dry Etch Process Develop Engineer

Job Summary

Dry Etch Process Engineer at Micron Technology's Technology Development organization. Responsible for developing, integrating, and optimizing plasma etch processes for next‑generation memory devices. Collaborates with integration, lithography, thin‑film, CMP, device, and manufacturing teams to mature processes from R&D to high‑volume manufacturing. Full‑time position located at Albany, New York (NYC site). Works closely with EUV Photo Lithography team and Technology Development teams in Boise, USA and Hiroshima, Japan.

• Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (dielectric, conductor, hardmask).
• Optimize critical process metrics including critical dimension control, etch profile/anisotropy, selectivity, microloading, uniformity, and line‑edge/line‑width roughness.
• Drive defect reduction and yield improvement using inline/out‑of‑line metrology, DOEs, SPC, and statistical data analysis.
• Perform root‑cause analysis and implement corrective actions for process excursions, tool health issues, and integration‑related failures.
• Partner with equipment vendors on chamber matching, hardware and recipe development, new capability evaluations, and cost‑of‑ownership improvements.
• Document process baselines, change controls, and learnings; communicate results and support technology transfer to high‑volume manufacturing.

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related engineering/technical field relevant to plasma processing and semiconductor manufacturing.
• B.S. with 3+ years of semiconductor processing experience with emphasis on dry etch/plasma etch (also considered).
• Experience in semiconductor process development or sustaining engineering, including DOE planning/execution and statistical data analysis.
• Working knowledge of plasma etch fundamentals, chamber hardware, and process characterization (profile, CD, selectivity, uniformity, defectivity).
• Ability to collaborate effectively across cross‑functional technical teams and communicate results clearly.

• Hands‑on experience with advanced dry etch platforms (e.g., ICP/RIE) and chamber matching across fleets.
• Familiarity with pattern transfer challenges (ARDE, microloading, footing/notching) and integration with lithography/hardmask stacks.
• Experience with defect characterization techniques and tool health monitoring methodologies.
• Experience working with semiconductor equipment vendors, joint development programs, or R&D environments.
• Familiarity with technology transfer to high‑volume manufacturing and sustaining support in a fab environment.

Estimated range: $ – $ per year (base). Additional compensation may include benefits, bonuses, and equity.

• Medical, dental, and vision plans.
• Income protection for illness or injury.
• Paid time‑off program and paid holidays.
• Paid family leave.
• Robust benefit programs that help protect income and prepare for the future.

Micron is an equal‑opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.