Director Pathfinding Solutions - Integrated Materials Solutions

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology.

Salary: $ - $

Location:

Albany,NY

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible-while learning every day in a supportive leading global company. Visit our Careers website to learn more.

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The Director, Pathfinding Solutions will serve as a deep technical leader and hands-on contributor who develops next-generation semiconductor process solutions spanning logic and memory device architectures. This individual will operate at the intersection of process engineering, device physics, and materials science — working across Applied's product Business Units to assemble and de-risk integrated pathfinding solutions for N+1, N+2 and beyond technology nodes.

This is a technically distinguished individual contributor role at the E5 / Director level. The ideal candidate is a recognized expert in advanced semiconductor process integration — someone who can independently conceive, develop, and demonstrate pathfinding solutions, engage credibly with customer technologists at senior levels, and influence Applied's product roadmaps through deep technical insights. This is not a traditional people management role;

it is a technical leadership position that demands world-class expertise, creativity, and execution.

• Develop and demonstrate integrated pathfinding process solutions for advanced logic (GAA, CFET) and / or memory (DRAM 4F2, 3D DRAM, NAND) device architectures
• Drive hands-on process development spanning deposition, etch, implant, epitaxy, CMP, and thermal processing — connecting individual process steps into integrated module flows
• Identify and de-risk critical process challenges for N+1 and N+2 (solving integration problems) technology nodes through systematic experimentation and DTCO (Design-Technology Co-Optimization) analysis
• Translate customer device performance targets (e.g., contact resistance reduction, carrier mobility enhancement, low-k integration, high-selectivity etch) into actionable Applied process solutions

• Work across Applied's product BUs to assemble end-to-end process flows that demonstrate Applied's differentiated value
• Partner with BU development teams to influence product roadmaps based on pathfinding learnings and customer requirements
• Collaborates with DTCO for integration-level analysis that connects individual process capabilities to device-level performance metrics (Vt, Idsat, leakage, RC delay, capacitance, resistance, strain, thermal, NAND)
• Coordinate wafer flow, DOE design, and data analysis across multiple BU tools and process modules

• Engage directly with senior technologists at key customers (Samsung, Intel, TSMC, SK Hynix, Micron etc) as a credible technical peer — presenting data, discussing integration approaches, and aligning on pathfinding priorities
• Lead technical discussions in customer Technology Review Meetings (TRMs), performance task forces, and pathfinding workshops
• Translate customer integration challenges into Applied-actionable development programs and demo plans
• Support customer co-development engagements by providing deep process expertise and…