Sr. Packaging Engineer
Listed on 2026-06-26
-
Engineering
Manufacturing Engineer
Elevate Quantum (EQ) is America’s Quantum Tech Hub—designated by the U.S. Department of Commerce andrepresentingthe largest concentration of quantum organizations in the world. EQoperatesat the center of a rapidly scaling ecosystem spanning industry, academia, national laboratories, and government across Colorado, New Mexico, and Wyoming. Our mission is to accelerate the commercialization of quantum technology and translate regional scientific leadership into lasting economic impact.
EQ is not a traditional nonprofit—it is an execution engine responsible for deploying capital, standing up infrastructure, and delivering measurable outcomes across a diverse portfolio of programs. The organization operates across five core business units:
Advanced Packaging FacilityFocused on high-mix, low- to medium-volume production, this facility supports quantum and advanced photonics companies with capabilities in optoelectronics packaging such as flip chip bonding, solder attach, wire-bonding, fiber-to-chip coupling, and various metrology capabilities. In partnership with Sandia National Laboratories, EQ is helping bridge the gap between research and scalable manufacturing.
Photonic Integrated Circuit (PIC) Fabrication FacilityA rapid-turn, low-volume fabrication facility designed for quantum-relevant materials (including silicon nitride and lithium niobate), enabling significantly faster iteration cycles than traditional foundries and supporting early‑stage and scaling companies alike.
Commercialization LabsA shared‑use environment offering access to advanced equipment, lab space, and the nation’s first open‑access, open‑architecture quantum system. These labs provide critical infrastructure for testing, prototyping, and validating emerging technologies.
Workforce DevelopmentSpanning Colorado and New Mexico, EQ’s workforce programs combine ecosystem coordination with hands‑on training delivered on real equipment. These programs are designed to build the next generation of quantum technicians and support a rapidly growing talent pipeline.
Consortium EngagementEQ manages a 150+ member coalition and convenes the broader ecosystem through advisory boards, CEO round tables, major events, and cross‑state collaboration. The organization also partners with state and regional entities to attract companies, align strategy, and drive continued investment into the region.
Together, these business units form a vertically integrated platform—one that spans infrastructure, talent, commercialization, and ecosystem activation. EQ’s role is to ensure these components operate cohesively to accelerate the path from scientific breakthroughs to commercial deployment at scale.
JOB SUMMARYReporting to the Director of Packaging, the Sr. Packaging Engineer will drive the development of optoelectronic packaging and integration processes, qualifying them and supporting the launch of new processes. As part of the development team, the Sr. Packaging Engineer will help identify and develop innovative solutions to process and manufacturing challenges in a team‑based and fast‑paced environment.
ESSENTIAL JOB FUNCTIONS- Planning and executingexperiments forthedevelopment of newelectronicand photonicpackaging processes (joining such as flip chipand wire bonding,reflow processes, optical couplingsuch as fiber to shipattach etc.).
- Employingvariousmetrology tools and techniques,and reliability tests to understand and improve the performance of the processes.
- Optimizingassemblyprocesses,FMEAand root cause analysis.
- Compiling and analyzingdata,writingreports, and presentingresults to team members and management.
- Supporting the launchof new processes and trainingmanufacturing personnel.
- Maintaining and improving the established processes and equipment,and providing support to production and troubleshooting technical issues.
- Interfacingwithvendors of equipment and process materials.
Required qualifications:
- M.S. or Ph.D. in Physics, Materials Science, Mechanical Engineering, Chemistry or related field.
- Minimum3-7years of experience with photonic systems and integration, electronic packaging, solder systems and reflow processes in a high-…
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).