Lead Engineer – RF Engineering

Worker Type Regular Job  Description We are seeking an RF PCBA Design and Test Engineer for the design, integration, and delivery of high-reliability RF/mixed-signal printed circuit assemblies for phased-array and advanced radar/communications products. You will own the PCB lifecycle—from stack-up definition and layout governance through fabrication, assembly, bring-up, release, and test lifecycle for production circuit card assemblies (CCAs) and integrated RF systems.

On any given day, the selected candidate may be asked to perform the following:

Define multilayer, hybrid dielectric RF stack- including impedance tables, via strategy (blind/buried, backdrill, VIPPO), copper weights, and plating/finish (ENIG/ENEPIG) to meet RF loss, isolation, and manufacturability targets.

Partition boards for RF, mixed-signal, and high-speed digital with attention to shielding, grounding, return paths, and thermal management (coins, thermal vias, heat spreaders).Establish and enforce RF layout rules (transitions, launch geometries, via fences, cavity cutouts, keep-outs) and high-speed constraints (length/phase matching, crosstalk control, reference continuity).Perform SI/PI/RF simulation and verification (e.g., ADS, HFSS, SIwave/Sigrity, CST) to predict insertion loss, VSWR/return loss, coupling, eye margins, and PDN impedance.

Lead schematic capture, ECAD library governance (footprints/3D models), and DRC/DFM sign-off in Altium/Cadence/Mentor.

Run formal design reviews, drive closure of action items, and maintain design histories, BOMs, and ECOs through PLM.Own fab and assembly drawing packages, stack-up notes, controlled impedance requirements, coupons, panelization, and testability features.

Collaborate with PCB fabs/CMs on builds (Class
3), negotiate tolerances, and resolve issues (mask alignment, plating thickness, impedance yield, lamination strategy).Plan and execute board bring-up; define acceptance tests and interface with RF test for S-parameters, noise figure, PAE, ACPR/EVM, and linearity (P1dB/IP3/AM-AM/AM-PM).Define, implement, and sustain acceptance tests for CCAs (Rx/Tx/control/power) with clear entry/exit criteria, coverage metrics, and pass/fail limits; maintain golden units and calibration artifacts.

Architect automated test sequences (Python/LabVIEW/MATLAB or similar) for VNAs, spectrum analyzers, signal generators, power meters, oscilloscopes, and RF switch matrices; integrate data logging, serialization, and dashboards; manage version control and CI where appropriate.

Required Qualifications Bachelor’s degree in electrical engineering or related engineering field.
5+ years in RF/microwave and mixed-signal PCB development for high-reliability products.

Technical Depth:

Proven expertise in RF board layout for L/S/C/X/Ku/Ka-band front-ends (LNAs, PAs, switches, beamformers, PLL/synth, couplers/splitters).Hands-on with hybrid stack-ups, controlled impedance design, backdrill/HDI strategies, and thermal/shielding practices.

Tools:
Proficiency with one or more ECAD suites (Altium Designer, Cadence Allegro/OrCAD, Mentor/Xpedition) and analysis tools (Keysight ADS, Ansys HFSS/SIwave, CST).Hands-on with RF measurements and analysis: S-parameters, gain/NF, linearity (P1dB/IP3), modulation metrics (EVM/ACLR), phase noise, timing/synchronization, PLL/synth chains, PA/LNA/mixer characterization.

Proficiency automating instruments and data pipelines (Python and/or LabVIEW; MATLAB a plus) using SCPI/IVI; experience with LAN/USB/GPIB control, data historians/MES, and dashboarding (e.g., Power BI/Tableau/SQL).Working knowledge of IPC-2221/2223, IPC-6012, IPC-A-600/-610 Class 3, ANSI/ESD S20.20, environmental/EMI test practices (e.g., MIL-STD-810/461 as applicable), calibration traceability,+ and DoD documentation practices.

Ability to obtain a DoD Top-Secret/SCI clearance.

Desired Qualifications Master’s degree preferred.

Experience delivering phased-array TR modules, beamforming IC integrations, or wideband front-ends in production.

Background in design for ruggedization and environmental screening (thermal cycling, vibe/shock) and reliability analysis (derating, FMEA).Familiarity with PLM (e.g., Arena/Windchill),…