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Advanced Packaging Technology Development Process Integration Engineer

Job in Albuquerque, Bernalillo County, New Mexico, 87101, USA
Listing for: Intel Corporation
Full Time position
Listed on 2026-07-21
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Quality Engineering, Systems Engineer
Salary/Wage Range or Industry Benchmark: 133800 - 188890 USD Yearly USD 133800.00 188890.00 YEAR
Job Description & How to Apply Below
## Advanced Packaging Technology Development Process Integration Engineer Apply locations:
US, New Mexico, Albuquerque time type:
Full time posted on:
Posted Todayjob requisition :
JR0285716#
** Job Details:**##

Job Description:

We are a global leader in semiconductor innovation, pushing the boundaries of silicon manufacturing and advanced packaging technology. Our Advanced Packaging Technology and Manufacturing (APTM) organization is at the forefront of next-generation chip solutions, delivering cutting-edge technologies that power the devices of tomorrow. With a culture built on collaboration, engineering excellence, and continuous innovation, we are committed to developing world-class talent and fostering an environment where bold ideas thrive.

Our facility in New Mexico, United States serves as a critical hub for technology development and high-volume manufacturing excellence.

We are seeking a talented and driven
** Process Integration Engineer
** to join our APTM Silicon Manufacturing Technology Development organization in
** Albuquerque, New Mexico, United States**. In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes. You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long-term packaging strategy.

This is an exciting opportunity to make a meaningful impact at the intersection of process development and high-volume manufacturing.
*
* Key Responsibilities:

*** Roadmap Enablement:
Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives

* Cross-Functional Collaboration:

Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions
* Defect & Yield Management:
Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data-driven methodologies to identify root causes and implement sustainable corrective actions
* Process Development:
Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development
* PRI Enablement & Transfer Readiness:
Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high-volume manufacturing
* Value Engineering:
Identify and implement cost-effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness
* Technology Transfer:
Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post-transfer
** As a successful candidate, you must possess
*** Collaborative Spirit — You thrive in team environments and naturally build strong working relationships across diverse groups and disciplines
* Effective Communication — You convey complex technical concepts clearly and confidently to both technical and non-technical audiences
* Adaptability — You remain composed and productive in a fast-paced, ever-evolving environment, embracing change as an opportunity
* Problem-Solving Mindset — You approach challenges with curiosity, creativity, and a structured, solutions-oriented attitude
* Ownership & Accountability — You take initiative, follow through on commitments, and hold yourself to a high standard of excellence
* Attention to Detail — You bring precision and thoroughness to your work, ensuring quality outcomes at every stage
* Innovative Thinking — You consistently look for smarter, better, and more efficient ways to achieve results

Are you ready to shape the future of semiconductor manufacturing? Join our world-class team in
** New Mexico, United States**, and be part of a mission-driven
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