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Advanced Packaging Technology Development Process Integration Engineer

Job in Albuquerque, Bernalillo County, New Mexico, 87101, USA
Listing for: PVH (Tommy Hilfiger/Calvin Klein)
Full Time position
Listed on 2026-07-23
Job specializations:
  • Engineering
    Process Engineer, Quality Engineering, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 95000 - 150000 USD Yearly USD 95000.00 150000.00 YEAR
Job Description & How to Apply Below

We are a global leader in semiconductor innovation, pushing the boundaries of silicon manufacturing and advanced packaging technology. Our Advanced Packaging Technology and Manufacturing (APTM) organization is at the forefront of next‑generation chip solutions, delivering cutting‑edge technologies that power the devices of tomorrow. With a culture built on collaboration, engineering excellence, and continuous innovation, we are committed to developing world‑class talent and fostering an environment where bold ideas thrive.

Our facility in New Mexico, United States serves as a critical hub for technology development and high‑volume manufacturing excellence.

We are seeking a talented and driven Process Integration Engineer to join our APTM Silicon Manufacturing Technology Development organization in Albuquerque, New Mexico, United States. In this role, you will play a pivotal part in enabling our advanced packaging manufacturing roadmap by developing and delivering upcoming technology nodes. You will serve as a key technical contributor, bridging process modules, device engineering, yield, and reliability teams to ensure that base die solutions are robust, manufacturable, and aligned with our long‑term packaging strategy.

This is an exciting opportunity to make a meaningful impact at the intersection of process development and high‑volume manufacturing.

Key Responsibilities
  • Roadmap Enablement:
    Lead the development and integration of upcoming advanced packaging technology nodes, ensuring alignment with the APTM packaging roadmap and strategic manufacturing objectives
  • Cross‑Functional

    Collaboration:

    Partner closely with process module teams, device engineering, yield, reliability, and internal and external stakeholders to develop and deliver comprehensive base die solutions
  • Defect & Yield Management:
    Own and drive closure of defect, yield (shipped and line), reliability, and device entitlement gaps, utilizing data‑driven methodologies to identify root causes and implement sustainable corrective actions
  • Process Development:
    Lead specific process development initiatives from concept through qualification, ensuring technical rigor and manufacturability at each stage of development
  • PRI Enablement & Transfer Readiness:
    Actively support Process Readiness Initiative (PRI) enablement and manage transfer checklist progress to ensure processes are robust, documented, and ready for seamless transition to high‑volume manufacturing
  • Value Engineering:
    Identify and implement cost‑effective process solutions through innovative thinking and value engineering principles, contributing to both technical performance and business competitiveness
  • Technology Transfer:
    Collaborate with manufacturing teams to ensure successful knowledge transfer, process stability, and continuous improvement post‑transfer
Candidate Profile

As a successful candidate, you must possess:

  • Collaborative Spirit – You thrive in team environments and naturally build strong working relationships across diverse groups and disciplines
  • Effective Communication – You convey complex technical concepts clearly and confidently to both technical and non‑technical audiences
  • Adaptability – You remain composed and productive in a fast‑paced, ever‑evolving environment, embracing change as an opportunity
  • Problem‑Solving Mindset – You approach challenges with curiosity, creativity, and a structured, solutions‑oriented attitude
  • Ownership & Accountability – You take initiative, follow through on commitments, and hold yourself to a high standard of excellence
  • Attention to Detail – You bring precision and thoroughness to your work, ensuring quality outcomes at every stage
  • Innovative Thinking – You consistently look for smarter, better, and more efficient ways to achieve results
Qualifications
  • Minimum qualifications:

    Bachelor's degree in Engineering, Material Science, Physics, or a related specialized field, with 3+ years of relevant experience; or a Master's degree in one of these fields with 2+ years of relevant experience; or PhD in the same fields with no experience. Relevant experience for this position will be:
    Process integration, yield analysis, quality management or process development in high‑volume manufacturing environments. Knowledge of semiconductor advanced packaging techniques and flows.
Preferred Qualifications

3+ years

Benefits

We offer a competitive compensation package, comprehensive benefits, and a dynamic work environment that champions growth, innovation, and collaboration.

Are you ready to shape the future of semiconductor manufacturing? Join our world‑class team in New Mexico, United States, and be part of a mission‑driven organization where your expertise will directly influence next‑generation packaging technologies.

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