Advanced Packaging Singulation Module Engineering Manager

Job Details

Job Description: Intel Corporation is a global leader in technology innovation, dedicated to creating world‑changing technology that enriches the lives of every person on earth. With a commitment to advancing computing power and connectivity, Intel drives innovation across a diverse range of industries, including computing, data centers, artificial intelligence, and more. Our collaborative culture fosters creativity and growth, empowering employees to make a meaningful impact in a dynamic and fast‑paced environment.

The position provides an exciting opportunity to lead an engineering team to support high‑volume manufacturing processes within Intel's next generation of advanced packaging technologies. As a Module Engineering Manager, you will play a critical role in leading, mentoring, and inspiring a team of module engineers and manufacturing operations engineers. Your contributions will directly impact Intel's ability to deliver high‑quality, cutting‑edge products by driving innovation, ensuring operational excellence, and fostering a collaborative and inclusive work environment.

You will lead the successful transfer of new products to high‑volume manufacturing, enabling Intel to remain at the forefront of technological advancements and deliver industry‑leading solutions to meet our customers' needs. This impactful role offers an opportunity to shape the future of manufacturing while developing strategies that ensure long‑term success.

This position is not eligible for Intel immigration sponsorship.

• Lead a team of module engineers and manufacturing operations engineers to support high‑volume manufacturing with robust and sustainable solutions.
• Provide clear direction and management for daily operations, including maintenance, process engineering prioritization, yield improvement, and efficiency enhancements.
• Drive continuous improvement in safety, quality, output, and cost while fostering a culture of productivity and innovation.
• Recommend and oversee the implementation of modifications to operating equipment to improve production efficiency, manufacturing techniques, and production output.
• Plan and direct activities for process and hardware development to enable the manufacturing of innovative device architectures.
• Coach and mentor engineers to build technical expertise and leadership skills within the team, ensuring a strong talent pipeline for the organization.
• Facilitate the transfer of technology to other sites through training, auditing, and ensuring matched processing across locations.
• Develop and implement long‑term strategies to enhance module engineering capabilities and meet future manufacturing requirements.
• Oversee the successful installation and qualification of Early Tool Sets and ramp production tools during factory ramps, ensuring all resources and processes are in place.
• Drive results by setting clear goals, maintaining accountability, managing differentiated performance, and ensuring a productive and inclusive work environment.

Minimum Qualifications

• Bachelor's or BS degree in engineering, materials science, physics, or a related technical field.
• A minimum of 6+ years of experience with a Bachelor's degree, 4+ years with a Master's degree, or 2+ years with a PhD.
• Experience in process characterization, and process improvement within a manufacturing environment.
• Knowledge of good manufacturing practices (GMP) and lean manufacturing principles.

Preferred Qualifications

• Experience in leading engineering teams with a focus on innovation and operational excellence.
• Strong background in advanced packaging singulation process knowledge.
• Familiarity with a track record of working collaboratively with vendors to drive results.
• Exceptional communication skills and the ability to inspire and influence diverse teams.
• Demonstrated success in developing and implementing long‑term strategic plans for engineering capabilities.

Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers — from delivering cutting‑edge silicon process and packaging technology leadership for the AI era,…