Mfg Engineer

Responsibilities

• Develop cost‑effective electronics packaging improvements to existing methods and work efforts for new products.
• Write technical reports and prepare presentations for peer review covering process development activities and next generation processing methods to support technologies used by customers in applications such as cloud servers, autonomous vehicles, military and industrial equipment.
• Manage equipment including programming and the SPC needed to ensure the highest yields, throughput, and lowest cost.
• Implement and manage real‑time SPC and utilize Six Sigma tools such as PFMEAs to implement meaningful process controls.
• Support the organizational goal of Automotive Readiness in preparation for IATF 16949 Certification.
• Monitor line yield, scrap and equipment utilization on a daily basis.
• Work independently as well as lead cross‑functional development teams using DMAIC process.
• Monitor line performance and take corrective action to eliminate process problems and improve yields.
• Work with Design, Test, and Quality Engineering to implement yield and quality enhancements.
• Work with hourly production and maintenance personnel to improve line performance.
• Review all new product designs for compatibility with process capability and make appropriate recommendations on new designs.
• Identify and lead cost‑reduction and quality‑improvement initiatives.
• Initiate and approve manufacturing documentation and ECOs.
• Investigate problems, determine root cause, and implement corrective and preventative actions.
• Perform occasional maintenance and troubleshooting.

Minimum requirements:

Bachelor’s degree in Mechanical Engineering, Industrial Engineering, or a related field plus 3 years of related experience. Alternatively, a Master’s degree in Mechanical Engineering, Industrial Engineering, or a related field plus 1 year of related experience is acceptable.

Must have:

• 1 year of experience in surface‑mount technology. Solid understanding of high‑volume equipment, materials and processes for a world‑class surface‑mount assembly line.
• Proficient in Minitab or other statistical analysis software and in Excel.
• Demonstrated experience in improving yields, throughput and Cpk in a high‑volume surface‑mount production line.
• Hands‑on experience in creating solder paste and flux printing programs as well as SPI and AOI inspection programs.
• Competent in creating reflow profiles.
• Knowledge of SPC, design of experiments and statistical analyses, and has applied this knowledge to making measurable improvements.
• Familiarity with Six Sigma tools such as failure modes and effects analyses and control plans to identify and prevent problems.
• Ability to be an independent, creative thinker to solve cutting‑edge technical challenges.
• Ability to work in a fast‑paced environment.
• Excellent written and verbal communication skills.

Salary: $102,669 to $130,000 per year.

An EOE.