1st Shift Wet Etch Process Support Engineer

Job Summary

An exciting opportunity exists at Raytheon for a to join the Etch processes production work center working on gallium arsenide, gallium nitride, and III-V focal plane array fabrication within the RF Microelectronics/Module Design & Foundry Services (RFMicro) Department. This role requires a basic understanding of microelectronics processing techniques such as deposition, photolithography, and etch but will primarily concentrate responsibilities on III-V wet chemistry processing including Wet Etch and Electroplating.

As a member of the RFMicro Department, the individual will be responsible for all deposition related processes of the semiconductor products fabricated in the Andover foundry. Daily duties include engineering support and training for manufacturing personnel, attending morning tier meetings, reviewing lots and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, looking for ways to reduce rework and scrap, and looking for ways to increase efficiency in the process line.

A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments.

The ideal candidate will have a working understanding of microelectronics processing techniques such as deposition, photolithography, and etch, be an excellent communicator, and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and documented processes, and the ability to work well in small cross‑functional teams is essential.

This role will be 100% on‑site and based in Andover, MA.

The salary range for this role is 86,800 USD - 165,200 USD.

• Processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment.
• Work autonomously with limited oversight.
• Influence others regarding policies, practices, and procedures.
• Review and disposition wafers on hold for evaluation in the work center.
• Work well in small, cross‑functional teams, assist in maintaining or improving production processes.
• Run process qualifications and trouble shoot process OOC (out of control) events.
• Actively communicate with parties within and outside of the work center (off‑shift engineers, work center leads, operation leads, manufacturing personnel, equipment team, etc.).

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM).
• A minimum of 6 years of prior relevant experience, or an advanced degree in a related field and minimum 4 years’ experience with semiconductor processing techniques such as photolithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections.
• Experience with wet chemistry processes (Wet Etches) and Electroplating.
• The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

• A degree in Science, Technology, Engineering, or Mathematics (STEM).
• Ability to present and communicate effectively across different functions.
• Clearly and succinctly document and present process development status in meetings.
• Knowledge related to semiconductor processing and data analysis.
• Experience utilizing data analysis software packages (e.g. MATLAB, Python, SQL, JMP).
• Experience with quality standards and audits.