3rd Shift Die Inspection Process Support Engineer

Eligibility Requirements

U.S. Person: This job requires a U.S. Person. A U.S. Person is a lawful permanent resident as defined in 8 U.S.C. 1101(a)(20) or who is a protected individual as defined by 8 U.S.C. 1324b(a)(3). U.S. citizens, U.S. nationals, U.S. permanent residents, or individuals granted refugee or asylee status in the U.S. are considered U.S. persons. For a complete definition of "U.S. Person" go here.

Security Clearance: DoD Clearance:
Secret. Active and existing security clearance required after day 1.

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

The RF Microelectronics/Module Design & Foundry Services (RFMicro) Department has an exciting opportunity available for to join the deposition processes production work center working on gallium arsenide, gallium nitride, and III‑V focal plane array fabrication within the RFMicro Department. This role requires a basic understanding of microelectronics processing techniques such as deposition, photolithography, and etch but will primarily focus on die inspection, die pick, automated die inspection and die singulation.

As a member of the RFMicro Department, the individual will be responsible for supporting backside related processes used to fabricate semiconductor products in the Andover foundry. Duties include coordinating with fab operation leads on the shift, communicating with engineering support within and across shifts through pass‑downs, training manufacturing personnel, reviewing lot status and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, identifying opportunities to reduce rework and scrap, and executing process and throughput improvement projects.

A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, operation leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. As the third shift process support engineer, communication of issues and status to other shifts is critical to provide information needed to execute effectively. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments.

The ideal candidate will have a working understanding of microelectronics processing techniques such as die inspection, die pick and place, automated die inspection, and die singulation, be an excellent communicator, and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and document processes, and the ability to work well in small cross‑functional teams is essential.

This role will be 100% on‑site and based in Andover, MA.

• Third shift requires onsite presence Monday-Thursday 9pm to 6:30am
• Processing wafers to create III‑V semiconductor devices in a cleanroom environment
• Work autonomously with limited oversight
• Influence others regarding policies, practices, and procedures.
• Review and disposition wafers on hold for evaluation in the work center
• Work well in small, cross‑functional teams, assist in maintaining or improving production processes.
• Actively communicate with parties within and outside of the work center (off‑shift engineers, work center leads, operation leads, manufacturing personnel, equipment team, etc.)

• Typically requires a Bachelor’s Degree in Science, Technology, Engineering or Mathematics (STEM)
• A minimum of 5 years of experience including experience working in a cleanroom environment, experience with semiconductor processing techniques such as optical microscope inspections, automated die inspection, wafer singulation, wafer bonding/thinning,…