Principal Engineer Concept; Module

We are looking for talented professionals to develop AI power supply packages focused on high‑performance computing modules.

• Define package concepts for AI power supply products with focus on high‑performance computing modules
• Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development and system architects
• Align new ideas and concepts with Back End development (in‑house + OSAT) and initiate assembly projects
• Follow up and support package development projects until final release of the product
• Identify new development topics and incorporate them into the package roadmap
• Support our customers with package specific questions
• Stay up to date on package solutions through continuous market screening and competitor analysis
• Identify business opportunities enabled by new technologies and concepts

• Technical background, e.g. Degree in Physics or Electronics
• 6 years practical experience in assembly technologies with detailed knowledge of Back End processes and materials and their dependencies (laminate design/materials/processes)
• Background knowledge of SMT related technologies
• Experience with typical package design tools (e.g. Autocad/Cadence)
• Very good communication and presentation skills

Wage range in Andover, MA:
Minimum of $156,900 per year / Maximum of $215,700 per year

Infineon Technologies Americas Corp., is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, national origin, ancestry, citizenship, age, physical or mental disability, legally protected medical condition, family care status, military or veteran status, marital status, domestic partner status, sexual orientation, or any other basis protected by local, state, or federal laws.