Senior Principal Semiconductor Equipment & Process Integration Engineer

Location

US-MA-ANDOVER-AR2 ~ 362 Lowell St ~ AR2 PLYMOUTH BLDG

United States of America

Onsite

The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

DoD Clearance:
Secret

Active and existing security clearance required after day 1.

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world.

Sr. Principal Semiconductor Equipment & Process Integration Engineer

We are seeking a highly skilled professional with a broad understanding of microelectronics processing and equipment, particularly in areas such as deposition, etch, photolithography, metrology, and process characterization, with expertise in at least one of these areas. In this role, you will work on cutting‑edge gallium arsenide, gallium nitride‑based devices, and III‑V focal plane array fabrication.

• Lead, manage, and support projects throughout the capital equipment lifecycle, including source selection, acquisition, facilities infrastructure, installation, qualification, sustainment, and troubleshooting.
• Develop a capital roadmap to identify and implement process and equipment capabilities that enhance wafer capacity, product yield, and next‑generation technology development.
• Drive initiatives in capital acquisition, process optimization, yield enhancement, rework reduction, equipment cost of ownership, and process development.
• Create and maintain schedules for tool and process qualifications while addressing capacity constraints and identifying opportunities for improvement.
• Collaborate with cross‑functional teams to understand foundry processes, identify limitations, and improve overall equipment effectiveness and throughput.
• Conduct statistical analysis and manipulate large datasets to define SPC (Statistical Process Control) metrics, correlate equipment input parameters with process outputs, and improve yield, cycle time, process capability, and equipment uptime.
• Frequently work directly on the foundry floor to resolve technical issues and interface with teams from operations, facilities, environmental health and safety (EHS), equipment, and quality.

• Typically requires a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) or an Advanced Degree in a related field and minimum 5 years’ of prior work experience.
• A minimum of 8 years’ of work experience in semiconductor processing techniques and capital equipment including photolithography, dry etching, wet chemistry, metals evaporation, sputtering and backside processing.
• The ability to obtain and maintain a U.S. government issued security clearance post‑start is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

• Experience managing and reporting on projects.
• Proven ability to lead cross‑functional teams and execute improvement initiatives.
• Excellent communication and coordination skills.
• Familiarity with III‑V semiconductor fabrication processes and techniques.
• Experience troubleshooting a wide range of fabrication equipment in addition to establishing equipment qualification and preventative maintenance procedures. Strong analytical and data‑driven approach to problem‑solving.
• Proficient in statistical process control and lean manufacturing methods (e.g., Six Sigma).
• Experience in a data analysis software package (e.g., Fab Guard, SQL, JMP).

Our values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value:
Trust, Respect, Accountability, Collaboration, and Innovation.

The salary…