Etch Section Lead – Semiconductor Fab

Overview

Raytheon Technologies seeks an engineering manager to join the Advanced Microelectronics Solutions (AMS) Department. The Etch Section Lead will direct a team of etch process engineers to fabricate advanced microelectronic devices in support of technology roadmaps and Raytheon business pursuits. The role requires on-site leadership in a 24/7 foundry environment across multiple shifts, and collaboration with operations and functional teams to meet production and development goals.

• Lead a team of etch engineers supporting 24/7 foundry operations (Dry Etch, Wet Etch, Wet Clean, Electroplating).
• Drive technical strategy for Etch processes within the foundry and review process changes to improve yields.
• Manage project schedules and costs; drive capital acquisition and qualification; lead process development activities.
• Coordinate resource allocation, identify future capital investment needs, and foster open communication between functional teams.
• Work with the department manager on manpower planning, overhead control, and performance reviews; develop/review proposals.
• Provide support to management at department, directorate, and functional leadership levels; relate to and support employee needs.
• Maintain on-site presence to understand technical and logistical issues; mentor up to 20 employees in their career development.

• Coordinate and lead an engineering team in a 24/7 manufacturing environment across five shifts.
• Review process changes and drive improvements to yield and throughput; interface with operations management.
• Oversee project schedules, costs, and capital requirements; support capital investment decisions.
• Foster effective resource allocation and cross-functional communication.

• Typically requires a Bachelor's Degree in a STEM field.
• Minimum of 10+ years of relevant semiconductor processing or process integration experience (advanced STEM degree may count for 3 years).
• The ability to obtain and maintain a U.S. security clearance; U.S. citizenship is required.
• Experience with GaAs, GaN, and/or GaSb processing is preferred; strong knowledge of dry and wet etch processes.
• Knowledge of Statistical Process Control (SPC) and root cause analysis; strong analytical skills.
• Leadership experience in a high-paced environment and ability to manage multiple priorities.
• Experience as Cost Account Manager or task leadership is a plus.
• Excellent written and oral communication skills; previous defense contractor/government agency experience is a plus.

• Master’s or PhD in STEM.
• Experience with GaAs, GaN, GaSb processes; deep technical knowledge of dry etch, electroplating, wet etch, and wet cleaning.
• Experience with project scheduling and management.
• Current DoD Secret level security clearance is a plus.

• Competitive salary range: 107,500 USD - 204,500 USD.
• Benefits including medical, dental, vision, life insurance, disability, 401(k) match, and more; eligibility varies by business unit.
• Paid time off, holidays, and parental leave; flexible work arrangements where applicable.
• Equal Opportunity Employer; affirmative action for individuals with disabilities and protected veterans.

RTX is an aerospace and defense company providing advanced systems and services to commercial, military, and government customers. It includes Collins Aerospace, Pratt & Whitney, and Raytheon. RTX is headquartered in Arlington, Virginia.