Experimental Thermal & Advanced Packaging Senior Scientist - R&D

Overview

Who we are Collaborative. Respectful. A place to dream and do. These are just a few words that describe what life is like  one of the world’s most admired brands, Toyota is growing and leading the future of mobility through innovative, high-quality solutions designed to enhance lives and delight those we serve. We’re looking for talented team members who want to Dream.

Do. Grow. with us.

Toyota does not offer support or sponsorship of job applicants for employment-based visas or any other work authorization for this role now or in the future. You must have the right to work in the United States and not require Toyota support or sponsorship for immigration‑related employment (e.g., H-1B, O-1, E‑3, H‑1B1, TN, F‑1 OPT, F‑1 STEM OPT, F‑1 CPT, ‘job flexibility benefits’ [also known as I‑140 or Adjustment of Status portability], etc.)

now or in the future. You should not apply for this role if you will require Toyota to assist with immigration support or sponsorship now or in the future.

Innovate, fabricate, assemble, and integrate heterogeneous packaging prototypes and test samples, including PCB‑embedded modules, DBC/AMB substrates, wide‑bandgap SiC/GaN devices, and electronic–photonic co‑packaged concepts. Lead the design, construction, and commissioning of in‑house test benches and experimental setups for thermal‑management and power‑module characterization. Plan and execute experiments to evaluate cooling and packaging concepts, analyze results, investigate root causes, and compare performance against state‑of‑the‑art benchmarks.

Develop and characterize hardware supporting next‑generation, high‑power‑density power‑converter technologies. Develop electronic–photonic co‑packaged prototypes and provide packaging and integration support for emerging quantum‑device technologies. Collaborate with photonic device foundries, component suppliers, and university research partners to coordinate sample fabrication, prototype assembly, and testing. Own project plans and technical milestones, identify risks, and drive research programs from initial concept through validated prototype.

Communicate research findings, insights, and recommendations clearly to global stakeholders and senior leadership through presentations, technical visualizations, and written reports. Publish significant results in leading scientific journals and conferences and mentor junior team members in experimental methods and research best practices. Development of intellectual property across different technology and packaging platforms.

• Must have a PH.D in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, or a related field.
• Must have 5 years of professional experience related to advanced electronics packaging, power electronics, semiconductor packaging, thermal management, or a closely related area.
• Experience with electronics packaging and heterogeneous integration, such as PCB‑embedded modules, DBC/AMB substrates, die attach, wire or ribbon bonding, flip‑chip assembly, or comparable assembly methods with ability to drive electrical, thermal, and mechanical co‑design for robust, scalable package solutions.
• Hands‑on experience building and troubleshooting laboratory test benches, thermal or cooling experiments, and in‑house hardware prototypes.
• Experience in thermal management, including thermal measurement, experimental characterization, and interpretation of test results.
• Proficiency with laboratory instrumentation, data‑acquisition systems, and Python‑based measurement automation.
• Familiarity with wide‑bandgap SiC or GaN power‑semiconductor devices and their packaging requirements.
• Demonstrated ability to independently lead experimental investigations,…