Sr Principal Semiconductor Equipment Engineer Jobs
Listed on 2026-08-16
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Engineering
Electrical Engineering, Systems Engineer
Job Title
Northrop Grumman is looking for a Semiconductor Equipment Engineer for their Advanced Packaging Technology Fab based in Apopka, FL.
Job RequirementsApopka, FL Secret Polygraph Unspecified Career Level not specified $122,800 - $184,200
Job DescriptionRELOCATION ASSISTANCE:
No relocation assistance available CLEARANCE REQUIRED FOR START:
No CLEARANCE TYPE:
Secret TRAVEL:
Yes, 10% of the Time At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon.
We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work - and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.
Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies.
Northrop Grumman's semiconductor foundry and packaging lines have unique capabilities of supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development. The wafer bumping line will support flip chips, 2.5D, and 3D packaging for internal production customers as well as emerging technology programs. The line will provide a range of bump compositions, including tin/lead, lead-free, microbumps, and copper pillar, using sputter, electro and electro-less plating, and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging.
The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout, cleanroom construction and installation of semiconductor equipment along with the daily, weekly, bi-weekly, quarterly, semiyearly and year equipment maintenance. Responsibilities include all aspects of facilities and factory layout for foundry equipment. The chosen candidate will develop and apply continuous improvement programs and be responsible for all aspects of project management including working with and direction of contractors/sub-contractors along with alignment with management.
May be responsible for running a group or groups of tools, from day-to-day maintenance/preventative maintenance operations (i.e. chemical management) up to and including service contracts with vendors. Minimal travel - one to three short trips per year.
The ideal candidate will:
- Have a demonstrated ability to work with cross organizational teams such as engineering, line maintenance and building maintenance.
- Possess strong leadership and communication skills.
- Be flexible to potentially work second shift as needed.
- Be willing and able to be on call.
- A bachelor's degree in related STEM field with a minimum of 8 years of relevant work experience; OR a master's in a related STEM field with 6 or more years of relevant work experience.
- A minimum of 6 years of experience working with semiconductor fabrication equipment or the construction industry.
- Experience with semiconductor wafer fabrication facilities and operation.
- Experience with fab facility, equipment installation, and maintenance.
- Experience with Computerized Maintenance Management System.
- Ability to obtain and maintain a Secret clearance.
- US Citizenship required.
- Experience with semiconductor equipment.
- Experience with semiconductor clean room design and construction.
- Experience with Architecture and Engineering ("A&E") drawing sets.
- Experience…
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