Senior Principal Signal Integrity Engineer

Location:

Greater Atlanta Area, Georgia, USA

Employment Type:

Full-Time

Permanent Industry: Semiconductor / High-Speed Electronics

We are working with an established semiconductor technology company seeking an experienced Senior Principal Signal Integrity Engineer to join its engineering organisation.

This is a senior technical position focused on the development and optimisation of next‑generation high‑speed memory interface technologies. The successful candidate will play a key role in signal integrity (SI), power integrity (PI), advanced packaging and system‑level performance analysis.

Working alongside experienced engineers across multiple disciplines, you will contribute to the design, simulation and validation of high‑performance semiconductor solutions for demanding computing applications.

The position offers significant technical ownership, opportunities to influence product architecture and direct involvement throughout the product development lifecycle.

• Develop and implement signal integrity and power integrity methodologies for advanced semiconductor products and high-speed memory interfaces.
• Lead SI/PI modelling, simulation and analysis activities at the component, package, PCB and system levels.
• Collaborate with IC design, packaging and validation teams to establish electrical specifications and system-level design requirements.
• Analyse high-speed interconnect performance, including signal loss, reflections, crosstalk, jitter and channel characteristics.
• Optimise package and PCB layouts, including routing strategies, power delivery networks, decoupling and BGA assignments.
• Perform system-level simulations to evaluate performance trade-offs and identify opportunities for design improvement.
• Correlate simulation results with laboratory measurements to validate design methodologies and improve modelling accuracy.
• Provide technical guidance to multidisciplinary engineering teams throughout the design and development process.
• Collaborate with external engineering partners and customers to address complex SI/PI challenges.
• Support laboratory characterisation, silicon validation, debugging and hardware bring‑up activities.
• Contribute to the ongoing development of engineering processes, simulation techniques and design best practices.

• Master's degree or PhD in Electrical Engineering or a closely related discipline.
• 10+ years of relevant industry experience, including substantial expertise in signal integrity, power integrity and advanced semiconductor packaging.
• Practical experience with high-speed memory interfaces, particularly DDR4 and/or DDR
  5.
• Experience modelling and simulating high-speed memory channels and/or Ser Des interfaces.
• Strong theoretical understanding of electromagnetic principles, transmission line theory and high-frequency circuit behaviour.
• Knowledge of signal equalisation techniques, including FIR, FFE, DFE and CTLE.
• Experience with package and PCB design methodologies, including SI/PI-driven layout optimisation.
• Ability to interpret and modify package and PCB layouts using Cadence Allegro, APD or comparable design tools.
• Proficiency in circuit and channel simulation using SPICE, Keysight ADS or equivalent software.
• Experience with electromagnetic modelling and analysis tools such as Ansys HFSS, Q3D or PowerSI.
• Extensive experience correlating simulated results with physical measurements using oscilloscopes, TDRs and vector network analysers.
• Understanding of signal degradation mechanisms, including crosstalk, jitter, insertion loss and their impact on bit error rate performance.
• Ability to investigate complex engineering problems and develop practical, technically sound solutions.
• Strong communication skills…