RFIC Packaging Designer Freq GaN/SiP, Onsite
Listed on 2026-10-18
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Engineering
Manufacturing Engineer, CAD/ AutoCAD/ Mechanical Design -
Design & Architecture
Manufacturing Engineer, CAD/ AutoCAD/ Mechanical Design
Falcomm seeks an IC Packaging Designer to advance RFIC packaging solutions for high-frequency performance and manufacturability. You will design and optimize packages, layouts, and substrates, collaborating with RFIC designers, layout engineers, and manufacturing partners to enable production-ready integration.
Ideal candidates have 3–5 years in RFIC packaging up to 50 GHz, experience with wirebond/flip-chip/PoP/SiP, and proficiency in major packaging tools, with full-time onsite work in
The following role is for a RFIC Packaging Designer – High‑Freq GaN/SiP, Onsite Atlanta with Falcomm.
We are looking to fill the RFIC Packaging Designer – High‑Freq GaN/SiP, Onsite Atlanta position at Falcomm in Atlanta, GA, United States.
The RFIC Packaging Designer – High‑Freq GaN/SiP, Onsite Atlanta role at Falcomm is now open for applications in Atlanta, GA, United States.
Join us at Falcomm as our next RFIC Packaging Designer – High‑Freq GaN/SiP, Onsite Atlanta in Atlanta, GA, United States.
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