Stamping Die Process Engineer

The Die Process Engineer is responsible for developing, validating, and optimizing die processes from early studio concept through
production launch. This role ensures that die construction, engineering changes, quality improvements, buyoff activities, and
tooling through puts meet program objectives. The engineer will collaborate closely with cross-functional teams—including
stamping, product engineering, quality, assembly, and external suppliers—to deliver high-quality panels and robust tooling
performance.

Responsibilities and Duties:

Process Engineering:
Review, define, and optimize die processes for assigned components.
Determine part orientation, die type, and process flow to meet surface, dimensional, and throughput targets.
Develop preliminary 6-Box processes and create NX models to support tooling concept and feasibility.
Establish proper trim, form, and secondary operations to achieve quality and production requirements.
Evaluate processes from previous programs to identify risks and apply lessons learned.

Tooling & Supplier Management:
Collaborate with tooling suppliers throughout design, construction, and tryout phases to ensure compliance with Stellantis
tooling standards.
Validate die construction, process methods, and panel quality during build and buyoff.
Conduct static and dynamic die buyoffs and support readiness for shipment.
Prepare requisitions and manage all procurement associated with die build and tryout.

Program & Launch Support:
Ensure material availability for tryout, early builds, and production readiness.
Coordinate and resolve process-related issues with product engineering, including engineering changes (E/C).
Support plant teams during die installation, debug, and industrialization.
Lead quality loops throughout launch, ensuring panels meet formability, surface, and dimensional requirements.

Technical Analysis & Quality:
Interpret and act on Forming Simulation, GD&T, FLD, and CMM data to improve die processes and panel outcomes.
Provide process feedback and implement improvements to enhance throughput and repeatability.
Drive continuous improvement in die capability, tool performance, and panel quality.