Advanced Packaging Technologist

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At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture.

We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

Together, we advance your career.

In this role, you will serve as a PCB‑centric Mechanical Modeling Architect responsible for defining and driving next‑generation packaging‑platform architectures through rigorous, model‑based decision making and System‑Technology Co‑Optimization (STCO). You will develop, validate, and apply mechanical and multi‑physics models to guide package/board‑level architecture, technology selection and integration of electro‑thermal and electro‑optical capabilities across package, board, and cooling solutions.

The ideal candidate is a self‑directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO‑driven architecture & design decisions and influence product and platform roadmaps for data center and high‑performance computing systems.

• Drive model‑based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack‑ups, high‑layer‑count designs, stiffness control and SMT & manufacturability considerations.
• Develop and maintain mechanical and multi‑physics models (structural, thermo‑mechanical, electro‑thermal and electro‑optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
• Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps.
• Serve as mechanical & multi‑physics subject‑matter expert for PCB and board‑level architectures with a primary focus on data center platforms.

• Demonstrated experience owning model‑based architecture & design decisions, supported by board‑, package-, and system‑level mechanical and multi‑physics modeling, characterization and validation.
• Strong background in advanced PCB technologies, including materials, high‑layer‑count designs, warpage and stiffness control, and assembly constraints.
• Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first‑principles understanding to multi‑physics package‑and‑system‑level design & assembly trade‑offs.
• Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
• Experience integrating electro‑thermal and electro‑optical technologies at the board and package level, informed by modeling and experimental correlation.
• Proven relevant industry or research experience with increasing responsibility in modeling‑driven system or platform architecture roles.

MS or PhD in relevant Engineering disciplines or physics.

Austin, Texas

This role is not eligible for visa sponsorship

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