Thermal Design Lead-Client Platforms

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Join AMD’s Client Engineering organization to lead thermal strategy and execution across pre‑ and post‑silicon for next‑gen CPUs, GPUs, and mobile systems. You’ll own thermal requirements, modeling, validation, and cross‑functional integration—delivering class‑leading products that delight users in performance, acoustics, and comfort.

This person will lead the full lifecycle of thermal engineering for client products, translating silicon and system requirements into effective cooling, power, and performance solutions from pre‑silicon design through post‑silicon validation. They will collaborate across architecture, platform, and customer teams to model, design, test, and optimize thermal behavior, make data‑driven trade‑offs, and clearly communicate risks, decisions, and progress to stakeholders up to the executive level.

• Lead end‑to‑end thermal program development for client products (pre‑silicon through validation and post‑silicon).
• Define silicon‑ and system‑level thermal, power, and cooling requirements; author clear customer‑facing documentation.
• Collaborate with CPU/GPU architecture, performance, BIOS/SMU, packaging, and customer engineering teams to align thermal strategies.
• Own thermal design, modeling (CFD), test, and debug for mobile & desktop platforms, drive design decisions and trade‑offs.
• Develop and validate fan policy/curves; optimize thermal controls for APU/CPU, GPU, and hybrid systems.
• Diagnose thermal interactions (power, performance, controls) at silicon, package, and system levels; rapidly drive alternative solutions.
• Ensure delivery of best‑in‑class designs by influencing IP floor plans, component placement, and system integration for thermals.
• Continuously improve processes, methodologies, and automation to accelerate thermal development and validation.
• Communicate status, risks, and decisions effectively to executives and cross‑functional stakeholders.

• Deep expertise in heat transfer and fluid dynamics, with hands‑on system‑level thermal design experience.
• Advanced proficiency in CFD for electronics cooling (Icepak and/or Flotherm).
• Strong background in thermal validation and debugging of new silicon and system hardware/software issues.
• Practical knowledge of thermal components and materials (fans, heatsinks, shields, spreaders, TIMs) and how they impact product performance.
• Ability to analyze and message package thermal resistance impacts (e.g., silicon performance, gen‑on‑gen changes) to internal and external audiences.
• Proven collaboration across architecture, power/performance, BIOS/firmware, and customer engineering teams.
• Executive‑level communication skills—able to distill complex technical topics into clear decisions and updates.
• Extensive lab experience including:
  • Data acquisition and automation
  • System teardown/rebuild, instrumentation (thermocouples, IR cameras, power/thermal sensors), and test fixture design.
  • System impedance and fan (P‑Q curve) characterization using an airflow bench.
  • Test planning, execution, and analysis for thermal performance, acoustics, and skin temperature.
• Mechanical CAD experience (Creo or Solid Works).
• Experience with Multiphysics modeling and warpage analysis is a bonus.
• Experience designing and validating fan control policies/curves for client systems.
• Familiarity with PC architecture and hands‑on system setup/testing (VRAM, NVMe, VR, memory, charging circuits).
• Understanding…