Design Engineering Manager, Texas Institute Electronics

Design Engineering Manager, Texas Institute for Electronics

Hiring Department: Texas Institute for Electronics

Position Open To: All Applicants

Weekly Scheduled

Hours:

40

FLSA Status: Exempt

Earliest

Start Date:

Immediately

Position Duration: Expected to Continue

Location: PICKLE RESEARCH CAMPUS

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state‑of‑the‑art 3D Heterogenous Integration manufacturing technology roadmap, and provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the U.S. DoD and the state of Texas, we’re at the forefront of creating cutting‑edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin – named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report – the Texas Institute for Electronics embodies the city’s innovative spirit.

• Competitive health benefits (employee premiums covered 100%, family premiums 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs:
  Tax‑Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through Linked In Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin’s libraries and museums with staff
• Free rides on all UT Shuttle and Austin Cap Metro buses with staff

The Design Engineering Manager will supervise a team of Design Engineers who will design and develop innovative semiconductor circuits and test structures to support TIE’s facility manufacturing highly reliable and leading‑edge 2.5D and 3D packaging solutions. This position will also manage and support multi‑material (Silicon, III‑V, Glass) and multi‑domain (Analog/Digital, RF, Power, Thermal, Mechanical Stress, Signal Integrity) design, modeling, and production activities.

• Supervise, guide, direct, and help train team of TIE Design Engineers through hands‑on collaboration. Assist with hiring, performance reviews, and upper management communication on product status and roadmap alignment.
• Design and develop mixed signal circuits, test vehicles, test chips, and test structures for TIE’s 3D‑ADK (Assembly Design Kit). Develop workflows, 2.5D/3D modeling methods, and standard cells for multi‑chiplet, heterogeneous micro‑systems.
• Collaborate with Product and Test engineering teams to ensure performance, yield, reliability, and BIST methodologies. Work with EDA vendors to evaluate and improve tool offerings and capabilities.
• Develop and implement advanced models for semiconductor packaging effects. Improve automation of circuits and layouts using scripting languages.
• Participate in industry “design standards” workshops and consortiums. Collaborate with internal and external design teams on package compatibility.
• Design and execute experiments for packaging performance optimization. Conduct multi‑physics modeling and simulation studies. Stay current with industry trends and emerging technologies.
• Other related functions as assigned.

• Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Materials Science, or a related field.
• 10+…