Senior Lead Engineer, Thermal Hardware Design

Senior Lead Engineer, Thermal Hardware Design

Date: Feb 11, 2026

Location: Austin, TX, US

If you’re reading this, chances are that you’re getting this information over at least one piece of hardware that we designed, developed, manufactured or service. Celestica is the brand behind the brands you love in tech. We design, develop, and manufacture leading‑edge Hardware Platform Solutions in Networking, Storage, and Server solutions from general purpose to customized Cloud, AI, machine learning, Edge and 5G deployments.

Across Data Centers and Enterprise deployments, we are partnered with an impressive roster of some of the world’s biggest tech companies. We work with 9 of the top 10 global internet service providers, 4 of the top 5 global storage providers, 3 of the top 5 networking OEMs, and the top 3 non‑X86 server providers engineering solutions for this generation and the next.

Our customers experience firsthand the power of our people - people who share a passion for innovation, technology, collaboration, performance and quality. People who, together, make a formidable team that is not only transforming our company, but transforming the technology landscape of the future. Celestica might not be a household name, but as you evaluate the companies, industries, cultures and teams that you are considering for your next career move, we hope that one thing will become very clear:
Celestica is no ordinary company. We are change makers. Innovators. And we have an unrelenting drive to find the way for our customers.

Let’s engineer the future together.

Performs tasks such as, but not limited to, the following:

• Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing.
• Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs.
• Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products.
• Conceive and implement ways to enhance and extend operation of heat transfer hardware.
• Consider the thermal aspects of chip packaging technologies.
• Apply best‑in‑class fluid flow geometry and technology to cool high heat flux chips.
• Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
• Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
• Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates.
• Plan your work to achieve full required performance, and stay on schedule to support overall product development.
• Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications.
• Perform hands‑on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording.
• Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness.
• Work with multi‑disciplinary groups to define system requirements and design products.
• Work with cross‑functional teams to identify root causes of system performance.

• Duties of this position are performed in a normal office environment.
• Duties may require extended periods of sitting and sustained visual concentration on a computer monitor or on numbers and other detailed data.
• Repetitive manual movements (e.g., data entry, using a computer mouse, using a calculator, etc.) are frequently required.
• Occasional travel may be required.

• 4 to 6 years in a similar role or industry.

• BA or MBA degree in Engineering. Preference giving to…