Semiconductor Mechanical Engineer

Job Summary

We are seeking a highly skilled and innovative Mechanical Engineer to join our semiconductor development team. This role focuses on the mechanical design, packaging, thermal management, and structural integrity of semiconductor devices and supporting systems. The ideal candidate will possess experience in precision engineering, microelectronic packaging, and materials science, with a keen eye for detail and quality.

• Design & Development:
  • Develop mechanical designs for semiconductor components, including chip packaging, heat sinks, enclosures, and interconnect structures.
  • Perform thermal, structural, and vibration analysis using simulation tools.
  • Collaborate with electrical engineers to ensure mechanical designs meet electrical and thermal performance specifications.
  • Review all CM mechanical drawings for completeness, corrections and adherence to requirements.
  • Develop or evaluate new or existing manufacturing processes for improvement and control, using tools such as Design of Experiments (DoE), Gage Repeatability and Reproducibility (Gage R&R) and Statistical Process Control (SPC).
  • Support R&D efforts of additive manufacturing as related to various aspects of electronic components – Packaging, substrate printing, PCB printing, etc.
• Materials & Manufacturing:
  • Interface with vendors to evaluate DFM (Design for Manufacturability) for components such as PCBs, die carriers, and encapsulants.
  • Ensuring the CMs can properly implement applied various IPC and JEDEC manufacturing standards.
• Testing & Validation:
  • Develop and execute test plans for thermal, mechanical shock, vibration, and environmental reliability.
  • Support failure analysis and root cause investigations.
• Project Management:
  • Maintain documentation including 3D models, drawings, BOMs, and manufacturing instructions.
  • Participate in cross-functional project reviews and provide input on product lifecycle decisions.

• Bachelor’s or Master’s degree in Mechanical Engineering or a related field or related experience.
• Must be a US Citizen; position requires ability to be granted a DoD clearance.
• 5+ years of experience in semiconductor packaging, electronics cooling, or precision mechanical systems.
• Proficiency in CAD tools such as Solid Works, Creo, or CATIA.
• Experience in PCB manufacturing and assembly in required qualifications.
• Familiarity with semiconductor fabrication processes, packaging standards, and materials.

• Experience with FEA tools and thermal simulation packages.
• Exposure to semiconductor reliability testing such as HALT/HASS.
• Experience working in a startup or fast-paced R&D environment.
• Experience with materials selection and evaluation suitable for high-reliability applications, and harsh environments (e.g., high temp, radiation).
• Experience in providing guidance for component selection for use in hermetically sealed enclosures. Understand off-gassing and long-term reliability concerns and constraints.

• Strong problem-solving skills and analytical mindset.
• Excellent communication and teamwork abilities.
• Attention to detail and a commitment to high-quality engineering practices.
• Ability to manage multiple priorities and adapt to evolving project requirements.
• Willingness to go hands-on and solve problems without ideal tools.

Phoenix Semiconductor Corporation is an Equal Opportunity Employer including individuals with disabilities and protected veterans. We are committed to ensuring equal employment opportunity for all applicants and employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.