Senior​/Principal RF Test Engineer, Texas Institute Electronics

Senior/Principal RF Test Engineer – Texas Institute for Electronics

Location:

Austin, TX

• Develop and execute RF test plans for K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz) microsystems at wafer, die, module, and system levels.
• Perform S-parameter characterization, on-wafer probing, noise figure measurements, and power sweeps using vector network analyzers, spectrum analyzers, and signal generators.
• Design and implement automated test sequences using Python, MATLAB, or LabVIEW to drive measurement instruments and collect production-grade data across process corners and temperature.
• Develop de-embedding methodologies and calibration strategies for high-frequency measurements, including TRL, LRRM, and multi-line calibrations for on-wafer and package-level probing.
• Correlate measured RF results against EM simulation models (HFSS, ADS, AWR, CST) to validate design intent and feed deviations back to the design and packaging teams.
• Characterize passive and active RF components—including transmission lines, filters, LNAs, PAs, and T/R modules—within 3.0D heterogeneously integrated assemblies.
• Support test infrastructure buildout, including fixture design, probe card specification, and lab setup for TIE's RF characterization capabilities.
• Author test reports, standard operating procedures, and design-for-test guidelines to support ecosystem partners and internal engineering teams.

• Define and own the RF test strategy for TIE's 3.0D heterogeneously integrated microsystems across K-band (18-27 GHz), Ka-band (27-40 GHz), and W-band (75-110 GHz), spanning wafer, die, module, and system levels.
• Architect end-to-end test flows—from design-for-testability requirements through production screening—ensuring robust, repeatable, and scalable characterization of RF, mixed-signal, and antenna-in-package subsystems.
• Lead development of advanced de-embedding, calibration, and measurement methodologies for novel 3
  
  DHI interconnect structures, including hybrid bonding interfaces, glass/Si interposers, and redistribution layers.
• Drive test-to-model correlation across EM simulation (HFSS, ADS, AWR, CST) and measured data, establishing feedback loops with design, process, and packaging teams to accelerate yield learning and performance optimization.
• Specify, procure, and commission RF test infrastructure—including probe stations, VNA configurations, automated handlers, and environmental chambers—for TIE's characterization lab buildout.
• Establish and mentor the RF test engineering team, setting technical standards, review processes, and best practices for measurement automation, data management, and statistical analysis.
• Engage with foundry, EDA, metrology, and defense-program partners to define and validate test enablement requirements for next-generation RF packaging technologies.
• Author test strategies, reliability qualification plans, reference test procedures, and design-for-test guidelines that become part of TIE's Assembly Design Kit (ADK) deliverables.

• M.S. in Electrical Engineering, Microwave Engineering, Applied Physics, or a related discipline with emphasis on RF/microwave measurement and characterization.
• 5+ years of hands‑on experience in RF/microwave testing, characterization, or validation of ICs, modules, or packaged systems operating at K‑band frequencies and above.
• Deep working knowledge of S‑parameter measurement, VNA calibration techniques, de‑embedding, and on‑wafer probing methodologies.
• Proficiency with RF test instruments (VNAs, spectrum analyzers, signal generators, power meters) and measurement automation using Python, MATLAB, or LabVIEW.
• Familiarity with RF simulation tools such as Keysight ADS, Ansys HFSS, Cadence AWR, or CST Studio for test‑to‑model correlation.
• Understanding of electromagnetic effects in advanced packaging—signal integrity, coupling, and loss across interposers, redistribution layers, and 3D stacked assemblies.
• Ability to work cross‑functionally with design, packaging, EDA, and process teams in a fast‑paced R/D environment.

• M.S. in Electrical Engineering, Microwave…