Mac Reliability Engineer

Do you ever wonder what goes into making Apple products an amazing user experience? The engineers on Apple's innovative reliability team are responsible for insuring that our products exceed our customer's expectations for robustness, durability, and reliability. We are looking for talented contributors who enjoy working on revolutionary products and aspiring to make them better through creation and execution of comprehensive test suites, identification of potential failure modes, and collaboration with design teams to drive product improvements.

The position is on Apple's innovative Mac Reliability Engineering team, where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables, development of new test procedures to quantify the reliability of a design, and failure analysis resulting from these tests.

Application of DOE (design of Experiments) Failure Analysis analytical techniques (Optical Microscopy, X-Ray, CSAM, SEM/EDS, FTIR, XPS etc) Knowledge of industry test Standards (JEDEC, ASTM, IEEE) Exceptional problem solving abilities, written and verbal communication skills and strong attention to detail Ability to manage multiple projects at the same time Dynamic and "can do" attitude with a desire to work with a great team and product Ability to travel internationally without restrictions

MS in Materials Science, Electrical, Mechanical Engineering or an equivalent field with 2+ years of relevant engineering experience Experience performing board level reliability testing including Mechanical Stress Tests, Shock/Drop/Vibration Testing, Environmental Testing Ability to use fundamental failure analysis methodology to derive root cause of failures, knowledge of failure modes and statistical life data analysis using curve fitting and distributions models Knowledge of board level design, DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecture Strong knowledge of Semiconductor package integration, SLI (Second Level Interconnect) reliability, passive components reliability, bonding materials and warpage control Ability to apply FMEA (Failure Modes an Effects Analysis) methodologies