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Packaging Substrate Engineer

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Apple Inc.
Full Time position
Listed on 2026-06-04
Job specializations:
  • Engineering
    Manufacturing Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 130000 USD Yearly USD 100000.00 130000.00 YEAR
Job Description & How to Apply Below

Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap;

and work with cross-functional teams to achieve the best package performance.

Description

Lead SoC package substrate technology development, pathfinding, and roadmap definition. Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions. 5% International travel

Responsibilities
  • Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap.
  • Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc.
  • Problem solving of technical issues during the full product development cycle.
Minimum Qualifications
  • Minimum requirement of a bachelors degree
Preferred Qualifications
  • MS and or Ph.D. and 3+ years of relevant industry experience.
  • In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap.
  • Hands‑on experience in substrate manufacturing and technology development:
    Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc.
  • Familiarity with package assembly and integration process preferred.
  • Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
  • Exceptional technology development & project management skills.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant.

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