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Manufacturing Engineer Packaging Engineer Systems Engineer

Lead Substrate Packaging Engineer — Innovation & Roadmap

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Apple Inc.
Full Time position
Listed on 2026-06-18
Job specializations:
  • Engineering
    Manufacturing Engineer, Packaging Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Apple Inc. is seeking a qualified individual in Austin, Texas, to lead the development of SoC package substrate technologies for its hardware technology team. This role involves working with cross-functional groups and industry partners to optimize packaging solutions. Candidates should have a solid academic background in engineering, preferably with an MS or Ph.D., and hands-on experience in substrate manufacturing processes.

Exceptional problem-solving and project management skills are a must.
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