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Lead IC Packaging Architect Advanced Packaging

Job in Austin, Travis County, Texas, 78716, USA
Listing for: AMD
Full Time position
Listed on 2026-06-26
Job specializations:
  • Engineering
    Packaging Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Lead IC Packaging Architect for Advanced Packaging

AMD in Austin, Texas is seeking an experienced Advanced Packaging Technology Leader to drive packaging architecture for cutting-edge products. This role requires collaboration with design and technology teams to create a robust packaging roadmap.

The ideal candidate will have a strong background in semiconductor technology, proven leadership in engineering, and exceptional communication skills. Benefits include a dynamic work environment and opportunities for professional growth.

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