Thermal Mechanical Modeling Engineer, Texas Institute Electronics

Thermal Mechanical Modeling Engineer

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs:
  Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through Linked In Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff
• Free rides on all UT Shuttle and Austin Cap Metro buses with staff

Must be eligible to work in the United States on a full-time basis for any employer without sponsorship.

This role is to lead and execute comprehensive thermal and mechanical simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

• Own and execute hands-on semiconductor package mechanical and thermal simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
• Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
• Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
• Run end-to-end simulation workflows including thermal/structural reliability checks, and co-simulation across domains.
• Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
• Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
• Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, Ser Des, HBM) and incorporate their requirements into package design methodologies.
• Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
• Other related functions as assigned.

• BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline.
• 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3
  
  DIC, or heterogeneous integration platforms.
• Strong expertise with EDA/EM/multiphysics tools:
  Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens Hyper Lynx, Keysight ADS, COMSOL, CST Studio.
• Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
• Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
• You're energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
• Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
• Location. Austin, Texas is required for close collaboration with our engineering teams and partners.

• MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
• 5 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3
  
  DIC, or heterogeneous integration platforms.
• Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
• Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density…