Engineering Director – Vacuum & Wet Systems- Bangalore, India

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

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Austin, TX, Bangalore, IND

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits ().

We are seeking an experienced and dynamic Engineering Leader in Semiconductor Hardware Development to drive the design, development, and delivery of advanced process equipment. The ideal candidate will bring deep technical expertise in Electrochemical Plating (ECP) equipment and/or wet cleaning systems, along with proven leadership in scaling high-performance engineering teams.

• Minimum 15+ years of experience in semiconductor equipment/hardware engineering
• Strong track record of leading complex system design and development programs in high-volume manufacturing environments
• Strong track record of delivering full tool platforms or critical modules into HVM (High Volume Manufacturing)
• Experience leading multi‑disciplinary engineering teams (mechanical, fluidics, process, electrical, controls)
• Proven ability to build and manage high‑performing, cross‑functional engineering teams

• Deep hands‑on experience in vacuum system design (mandatory), including chamber architecture, gas delivery, pumping systems, and contamination control
• Strong expertise in Electrochemical Plating (ECP) systems
• Design and optimization of plating chambers, fluid delivery systems, and current distribution architectures
• Understanding of wafer‑level deposition uniformity, defect control, and process integration
• Experience with electrolyte chemistry management, filtration, and recirculation systems

• Design of single‑wafer and batch cleaning systems, including chemical dispense, rinse/dry modules, and fluid handling systems
• Knowledge of surface preparation, contamination removal, and defectivity reduction techniques
• Familiarity with materials compatibility, corrosion control, and chemical safety considerations
• Demonstrated ownership of module‑level or full system design, including mechanical, fluidic, thermal, and process integration aspects
• Strong problem‑solving capability in highly complex, failure‑sensitive environments, including root cause analysis and reliability engineering

• Experience in end‑to‑end equipment design, from concept architecture to qualification and production release
• Expertise in multi‑physics system interactions (fluidics, electrochemistry, thermals, and vacuum environments)
• Exposure to process‑tool interactions, including yield improvement, defectivity control, and throughput optimization

• Experience working with North American semiconductor OEMs or technology organizations
• Proven success in cross‑regional collaboration, including onsite engagements and global program execution

• Strong technical credibility demonstrated through:
• Patents in semiconductor equipment, ECP, or wet processing domains
• Conference…