Yield Enhancement Engineer, Texas Institute Electronics
Listed on 2026-07-06
-
Engineering
Process Engineer, Quality Engineering, Electronics Engineer, Manufacturing Engineer
Overview
Yield Enhancement Engineer, Texas Institute for Electronics
Location:
Austin, TX
Department:
Texas Institute for Electronics (TIE)
Position Open To:
All Applicants
Weekly Scheduled
Hours:
40
FLSA Status:
To Be Determined at Offer
Earliest
Start Date:
Ongoing
Position Duration:
Expected to Continue
The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, pre-eminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.
Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more.
UT Austin offers outstanding employee benefits and total rewards packages including:
Competitive health benefits, voluntary insurance options, paid vacation, sick time and holidays, state retirement plans and other programs. UT Austin is located in Austin, named a top city for livability.
- Analyze electrical, inline, defectivity, and reliability data to identify yield loss mechanisms and drive corrective actions.
- Develop and execute yield improvement plans for NPI and high-volume manufacturing products.
- Perform process integration studies across lithography, etch, deposition, CMP, plating, cleaning, and metrology modules.
- Correlate process parameters with yield, reliability, and device performance metrics.
- Drive root cause analysis using DOE, SPC, Pareto analysis, FMEA, and statistical methodologies.
- Support technology transfer from development to manufacturing with stable process windows and manufacturability improvements.
- Work closely with process, equipment, quality, product, reliability, and customer teams to resolve technical issues.
- Monitor excursion trends and establish preventive actions to improve process robustness.
- Define process control strategies, specifications, and yield monitoring methodologies.
- Participate in failure analysis reviews and develop containment/corrective action plans.
- Support customer qualification activities and technical discussions.
- Generate technical reports, presentations, and documentation for management and customers.
- Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
- 3 years of semiconductor Process Integration or Yield Engineering experience
- Strong understanding of semiconductor fabrication or advanced packaging process flows
- Experience with statistical data analysis tools such as JMP, Minitab, Python, or Excel. Knowledge of SPC, DOE, Cp/Cpk, yield analysis, and defect reduction methodologies
- Familiarity with electrical test data analysis and inline metrology correlation. Experience supporting NPI and high-volume manufacturing environments
- Strong problem-solving and cross-functional communication skills
Relevant education and experience may be substituted as appropriate.
Preferred Qualifications- Master’s degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
- More than 3 years of semiconductor Process Integration or Yield Engineering experience
- Experience in advanced packaging technologies such as hybrid bonding, TSV, Cu damascene, or wafer-level packaging
- Knowledge of reliability failure mechanisms and FA techniques
- Experience with automation/data visualization tools
- Customer-facing technical support experience. Exposure to AI/ML-based yield analytics is a plus.
UT Austin offers a…
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