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IC Packaging Architect: Lead Advanced Packaging & Yield

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Advanced Micro Devices
Full Time position
Listed on 2026-07-13
Job specializations:
  • Engineering
    Packaging Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 150000 USD Yearly USD 120000.00 150000.00 YEAR
Job Description & How to Apply Below

Advanced Micro Devices (AMD) is seeking a leader in Advanced Packaging Technology for driving packaging architecture across multiple product lines. In this hybrid role based in Austin, Texas, you will collaborate with product design and technology partners to define packaging roadmaps.

The ideal candidate has extensive experience in semiconductor technology development and proven leadership in engineering teams. Communication skills are essential for sharing recommendations with various stakeholders.

AMD offers an inclusive environment and various benefits to support our workforce.

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