CVD Process Engineer - Wafer Bonding
Listed on 2026-07-14
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Engineering
Electrical Engineering, Process Engineer, Quality Engineering, Systems Engineer
Position Summary
Samsung Austin Semiconductor is seeking an experienced engineer to deliver technical leadership in wafer bonding and de‑bonding. The primary duties include designing and executing process experiments, analyzing bonding quality and reliability, troubleshooting process issues, and collaborating with cross‑functional teams to improve bonding techniques. This role must ensure compliance with industry standards and maintain detailed documentation of process parameters and results. The technical aspects of bonding equipment operation will be the primary responsibility and keeping the 24/7 wafer bonding operation smooth.
Roleand Responsibilities Equipment Setup and Operation
- Prepare and calibrate bonding and debonding equipment according to manufacturer specifications and process requirements.
- Ensure tool‑to‑tool matching across fabs and between tools.
- Develop and maintain preventative maintenance schedules and procedures.
- Ensure bonding meets device and process output specifications.
- Successfully transfer and qualify process from development fab to HVM facility.
- Investigate wafer bonding issues, create troubleshooting plans, and apply corrective action plans.
- Provide clear updates and instructions to users and management regarding ongoing issues and resolutions.
- Maintain FMEA and manage RPN reduction activity.
- Lead development and design experiments to carry out improvements in bonding yield, reliability, cost, and throughput.
- Collaborate with vendors in evaluation and qualification of new bonding and de‑bonding techniques.
- Provide technical support and training to operators and technicians on equipment operation and procedures.
- Present key technical developments to SAS technical staff and management.
- Knowledge and familiarity with hybrid bonding techniques and equipment.
- Bachelor’s degree in Engineering or a related technical discipline.
- Minimum of 5 years of engineering experience in Fab Equipment management.
- Minimum of 3 years of experience in wafer bonding and de‑bonding equipment.
- Experience in the semiconductor environment or in high‑volume advanced manufacturing.
- Desire to take on technical challenges and shifting priorities in a fast‑paced cutting edge environment.
- Team‑oriented culture; ability to work with others.
- Data analysis skills: quickly analyze, summarize, and present data in an easy‑to‑understand format.
- Project management and prioritization: define milestones, manage multiple projects, balance long‑term and daily sustaining work.
- Rapid learning of new computer applications and systems.
- Availability for several hours per day in a clean room environment.
- Familiarity with semiconductor equipment: vacuum systems, RF systems, plasma, MFCs, pneumatic valves, recipes, safety considerations & protocols, schematics, maintenance scheduling.
- Ability to manipulate and interpret equipment sensor data for advanced troubleshooting and setting up control for equipment sensors.
- Basic programming in VBA, Python, R, SQL, or other.
The current base salary range for this role is between $70,480 and $179,090. Individual base pay rates will depend on duties, location, education, skills, qualifications, and experience. Total compensation will include a competitive benefits package and may include incentive compensation based on performance.
Benefits- Medical, dental, and vision insurance.
- Life insurance and 401(k) matching with immediate vesting.
- Onsite café(s) and workout facilities.
- Paid maternity and paternity leave.
- Paid time off (PTO) + 2 personal holidays and 10 regular holidays.
- Wellness incentives and more.
- Eligible full‑time employees may receive MBO bonuses based on company, division, and individual performance.
This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.
Trade Secrets NoticeBy submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.
Equal Employment OpportunitySamsung Electronics America, Inc. and its subsidiaries are committed to Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, status as a qualified individual with a disability, or any other characteristic protected by law.
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