Senior Failure Analysis Engineer - 3D Packaging & Metrology
Job in
Austin, Travis County, Texas, 78716, USA
Listed on 2026-07-17
Listing for:
University of Texas
Full Time
position Listed on 2026-07-17
Job specializations:
-
Engineering
Electronics Engineer, Quality Engineering, Process Engineer
Job Description & How to Apply Below
Texas Institute for Electronics (TIE) at UT Austin invites applications for a Failure Analysis Engineer to lead advanced surface characterization of 3D semiconductor packages. The role involves establishing a characterization facility, engaging with customers, and collaborating with materials, process engineering, and design teams.
The successful candidate will analyze failures, optimize recipes, and contribute to knowledge bases and best practices.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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