Mechanical Engineer, Annapurna Labs, Machine Learning Hardware; AWS

Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Annapurna Labs (our organization within Amazon) designs silicon and software that accelerate innovation. Customers choose us to create cloud solutions that solve challenges unimaginable a short time ago. Our custom chips, accelerators, and software stacks enable us to take on technical challenges never seen before, delivering results that help our customers change the world.

• Design and optimize hardware for machine learning acceleration in data center servers.
• Lead application of new technologies to large‑scale server deployments, ensuring world‑class performance, quality, and cost.
• Develop systems from lowest circuit design to high‑volume manufacturing, shaping the machinery that powers AWS data centers.
• Perform thermal and performance measurements and characterization on SoCs, servers, and systems.
• Model SoC thermal behavior, IC package transient thermal response, and provide detailed CFD and compact RC models.
• Collaborate with vendors, ODMs, and internal teams to identify, triage, debug, and resolve cross‑boundary issues.

• BS or MS in Mechanical/Thermal Engineering.
• 3+ years industry experience in mechanical and thermal design of systems.
• Experience in thermal and performance measurements and characterization on SoCs, servers, and systems.
• 3+ years of experience in SoC thermal modeling and IC package transient thermal response.
• Experience with chip package, system mechanical & thermal design for air‑cooled and liquid‑cooled systems.
• Effective collaboration with cross‑site teams and development of detailed specifications.
• Work with ODMs, heatsink vendors, and internal design teams on triaging, debugging, and resolving issues.

• Knowledge of SoC thermal/mechanical design methodology, power modeling, and thermal analysis techniques.
• Tool familiarity:
  Ansys Icepak, Flo Therm, Cadence Celsius, PTC Creo, and Solidworks.
• Programming experience:
  Bash, Shell, Python, Lua, and familiarity with Linux environment.
• Working knowledge of fans, valves, chillers, CDUs, and heatsink solutions.
• Knowledge of thermal interface materials (TIMs) and liquid cooling technologies.
• Experience developing detailed CFD and compact RC models for SoC and package thermal analysis.
• Knowledge of hardware and software based thermal / power management control algorithms.
• Optimization of thermal solutions under PPA and system design constraints.
• Simulation and prototype of thermal control strategies.
• Validation of thermal models through power/thermal measurements on hardware.

Amazon is an equal‑opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status. Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation during the application and hiring process, please visit the accommodations page listed in the job posting.

Amazon offers comprehensive benefits including health insurance, vision, dental, prescription, life, disability, 401(k) matching, paid time off, and parental leave.

Location:

Austin, TX, USA

Annual salary range: $136,000 – $184,000