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Lead Layout Engineer 5D/3D IC Packaging
Job in
Austin, Travis County, Texas, 78716, USA
Listed on 2026-07-18
Listing for:
Amazon
Full Time
position Listed on 2026-07-18
Job specializations:
-
Engineering
Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
Amazon’s Annapurna Labs within AWS seeks a Package Layout Design Engineer to advance IC packaging for next‑gen ML and data center ASICs. You’ll drive physical design from floor planning to tape out, collaborating with SI/PI, thermal, and manufacturing teams to meet density and reliability targets.
You will work on 2.5D/3D‑IC packaging, RDL routing, substrate design, and cross‑level layout optimization, ensuring DFM compliance and timely design closure.
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