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SOC Thermal Engineer

Job in Austin, Travis County, Texas, 78701, USA
Listing for: Apple
Full Time position
Listed on 2026-07-19
Job specializations:
  • Engineering
    Systems Engineer, Electrical Engineering, Electronics Engineer, Mechanical Engineer
Job Description & How to Apply Below

SOC Thermal Engineer

Work Locations (2) Submit Resume

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device's thermal performance and participate in advanced IC packaging research and development.

Description

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.

Responsibilities
  • This position is responsible for thermal analysis and design of thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.
Minimum Qualifications
  • BS + 10 years of industry experience.
Preferred Qualifications
  • MSEE +10 years of industry experience.
  • Demonstrated leadership capabilities at the senior engineer level.
  • Deep expertise in thermal design for silicon devices and packaging solutions.
  • Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
  • Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
  • Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products
  • Proficiency with industry-standard tools including Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, and Red Hawk.
  • Experience designing and executing experimental test setups and analyzing thermal data.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant At Apple, we believe accessibility is a fundamental human right.

You'll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong. Learn about accessibility in Apple's workplace Learn about reasonable accommodations for job applicants Apple accepts applications to this posting on an ongoing basis.

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