Product Development Engineer - Thermal Engineering

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AMD is seeking a Thermal Engineer to serve as a key technical contributor within our advanced packaging and New Product Introduction (NPI) organization. In this role, you will drive thermal characterization, validation, and technology development activities for cutting‑edge package architectures and next‑generation products. You will collaborate closely with package design, reliability, manufacturing, test, and product engineering teams to evaluate thermal performance, support qualification efforts, and enable successful product ramps.

This position offers the opportunity to develop innovative thermal test methodologies, influence future packaging technologies, and work with global engineering teams and manufacturing partners to solve complex thermal challenges throughout the product lifecycle.

The ideal candidate is a hands‑on engineer who enjoys solving complex thermal challenges through a combination of experimentation, analysis, and collaboration. You are naturally curious, detail‑oriented, and comfortable working across multiple disciplines to drive technical solutions. You thrive in fast‑paced development environments, effectively communicate technical concepts, and demonstrate strong ownership from concept through production.

A successful candidate will be proactive, highly analytical, and motivated to continuously improve thermal characterization techniques and engineering processes while supporting the development of industry‑leading products.

• Serve as the thermal SME for advanced packaging technology development and NPI programs.
• Lead thermal characterization activities, including Thermal Test Vehicle (TTV) development, testing, data analysis, and validation.
• Develop thermal models and correlate simulation results with laboratory measurements.
• Partner with cross‑functional teams to assess thermal performance, identify risks, and implement solutions.
• Support qualification, product bring‑up, manufacturing transfers, and production activities with OSAT partners.
• Investigate thermal issues, perform root‑cause analysis, and drive corrective actions.
• Contribute to future technology pathfinding and continuous improvement of thermal methodologies and infrastructure.

• Experience in thermal engineering within semiconductor, electronics, data center, or advanced packaging environments.
• Strong understanding of heat transfer principles and thermal management techniques.
• Experience with Thermal Test Vehicles (TTVs), thermal characterization, and laboratory testing.
• Familiarity with thermal modeling, simulation correlation, and data analysis.
• Experience supporting NPI, qualification, manufacturing, and OSAT engagements.
• Strong analytical, troubleshooting, communication, and collaboration skills.

• Bachelor’s degree preferred in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Materials Science & Engineering, or a related engineering discipline.
• Advanced degree in a relevant engineering field is a plus.

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s "Responsible AI Policy" is available here.

This posting is for an existing vacancy.