Yield Enhancement Engineer

Responsibilities

• Analyze electrical, inline, defectivity, and reliability data to identify yield loss mechanisms and drive corrective actions.
• Develop and execute yield improvement plans for NPI and high-volume manufacturing products.
• Perform process integration studies across lithography, etch, deposition, CMP, plating, cleaning, and metrology modules.
• Correlate process parameters with yield, reliability, and device performance metrics.
• Drive root‑cause analysis using DOE, SPC, Pareto analysis, FMEA, and statistical methodologies.
• Support technology transfer from development to manufacturing with stable process windows and manufacturability improvements.
• Work closely with process, equipment, quality, product, reliability, and customer teams to resolve technical issues.
• Monitor excursion trends and establish preventive actions to improve process robustness.
• Define process‑control strategies, specifications, and yield monitoring methodologies.
• Participate in failure analysis reviews and develop containment/corrective action plans.
• Support customer qualification activities and technical discussions.
• Generate technical reports, presentations, and documentation for management and customers.

• Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field.
• 3 years of semiconductor Process Integration or Yield Engineering experience.
• Strong understanding of semiconductor fabrication or advanced packaging process flows.
• Experience with statistical data analysis tools such as JMP, Minitab, Python, or Excel.
• Knowledge of SPC, DOE, Cp/Cpk, yield analysis, and defect reduction methodologies.
• Familiarity with electrical test data analysis and inline metrology correlation.
• Experience supporting NPI and high‑volume manufacturing environments.
• Strong problem‑solving and cross‑functional communication skills.