Senior Package Design Engineer - Semiconductor Packaging

Hybrid

This Jobot Job is hosted by:
Madeline Lazarus
Are you a fit? Easy Apply now by clicking the "Apply Now" button and sending us your resume.
Salary: $150,000 - $300,000 per year

A bit about us:

We are a leading AI semiconductor company developing high-performance computing technology that is redefining the future of artificial intelligence. Our engineering teams are building advanced processors, software platforms, networking solutions, and semiconductor technologies from the ground up while fostering a highly collaborative environment focused on innovation and solving technically demanding challenges.

Why join us?

Work on some of the industry's most advanced AI semiconductor programs.
Collaborate directly with world-class silicon, package, SI/PI, and systems engineers.
Gain exposure to emerging packaging technologies including chiplets and 2.5D integration.
Influence package architecture during early design phases rather than production support.
Join a rapidly growing engineering organization tackling next-generation computing challenges.

Job Details

We're seeking an experienced Package Design Engineer to support early-stage semiconductor package development through package-board co-design activities. You'll develop routing studies, board design mockups, and electrical modeling collateral used to optimize package architecture, BGA implementation, and overall system performance.

Location:

Santa Clara, CA Hybrid Minimal travel

What you will be doing:
Create PCB routing studies supporting package development
Develop board-level design mockups for electrical modeling
Perform package escape routing and BGA optimization studies
Analyze routing congestion and layer utilization
Support Signal Integrity and Power Integrity modeling
Build representative PCB environments for package evaluation
Collaborate with package, SI/PI, mechanical, and systems engineering teams
Evaluate design tradeoffs during early architecture phases
Contribute automation and workflow improvement initiatives
Support advanced package-board co-design activities

Must have skills:
3+ years using Cadence Allegro PCB Designer

Experience with high-pin-count BGA layouts
Strong PCB routing expertise
Understanding of package escape strategies
Knowledge of Signal Integrity fundamentals
Knowledge of Power Integrity fundamentals

Experience with complex, high-speed interconnects
Strong cross-functional communication skills
Comfortable working through ambiguous engineering challenges
Interest in AI-driven engineering automation

Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.

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