Senior Package Design Engineer – Semiconductor Packaging

Senior Package Design Engineer – Semiconductor Packaging $150000 - $300000 per year | Santa Clara, CA | Hybrid | Permanent Join an industry‑leading AI company where you'll collaborate across silicon, package, and system teams to solve complex package design challenges. A bit about us:

We are a leading AI semiconductor company developing high‑performance computing technology that is redefining the future of artificial intelligence. Our engineering teams are building advanced processors, software platforms, networking solutions, and semiconductor technologies from the ground up while fostering a highly collaborative environment focused on innovation and solving technically demanding challenges.

• Work on some of the industry's most advanced AI semiconductor programs.
• Collaborate directly with world‑class silicon, package, SI/PI, and systems engineers.
• Gain exposure to emerging packaging technologies including chiplets and 2.5D integration.
• Influence package architecture during early design phases rather than production support.
• Join a rapidly growing engineering organization tackling next‑generation computing challenges.

We're seeking an experienced Package Design Engineer to support early‑stage semiconductor package development through package‑board co‑design activities. You'll develop routing studies, board design mockups, and electrical modeling collateral used to optimize package architecture, BGA implementation, and overall system performance.

Location:

Santa Clara, CA
• Hybrid
• Minimal travel

• Create PCB routing studies supporting package development
• Develop board-level design mockups for electrical modeling
• Perform package escape routing and BGA optimization studies
• Analyze routing congestion and layer utilization
• Support Signal Integrity and Power Integrity modeling
• Build representative PCB environments for package evaluation
• Collaborate with package, SI/PI, mechanical, and systems engineering teams
• Evaluate design tradeoffs during early architecture phases
• Contribute automation and workflow improvement initiatives
• Support advanced package-board co‑design activities

• 3+ years using Cadence Allegro PCB Designer
• Experience with high-pin‑count BGA layouts
• Strong PCB routing expertise
• Understanding of package escape strategies
• Knowledge of Signal Integrity fundamentals
• Knowledge of Power Integrity fundamentals
• Experience with complex, high-speed interconnects
• Strong cross‑functional communication skills
• Comfortable working through ambiguous engineering challenges
• Interest in AI‑driven engineering automation

Jobot is an Equal Opportunity Employer. We provide an inclusive work environment that celebrates diversity and all qualified candidates receive consideration for employment without regard to race, color, sex, sexual orientation, gender identity, religion, national origin, age (40 and over), disability, military status, genetic information or any other basis protected by applicable federal, state, or local laws. Jobot also prohibits harassment of applicants or employees based on any of these protected categories.

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