Process Engineer, Texas Institute Electronics

Job Title

Process Engineer, Texas Institute for Electronics

PICKLE RESEARCH CAMPUS

The Process Engineer develops and executes semiconductor fabrication process flows for advanced 3D HI applications using a wide variety of internal and external fabrication resources.

• Running, developing and integrating semiconductor fabrication processes across a wide variety of semiconductor equipment. This would include running experiments, performing detailed process characterization, performing data analysis, documentation of processes of record, presentation of results, and incorporating feedback from engineers/techs.
• Developing processes-of-record and implementing these on product samples for customers.
• Assisting with documents such as proposals or reports on costs and inventory levels.

High School Diploma or GED and at least ten years of experience in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines, or,

Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and at least six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in clean rooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in clean rooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or,

Master’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and six years of relevant experience in nanofabrication and exposure to wafer processing and characterization in clean rooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

Bachelor’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and ten years of experience in nanofabrication and exposure to wafer processing and characterization in clean rooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection, or

Master’s degree in materials science, physics, chemistry, chemical engineering, electrical engineering, mechanical engineering, or other relevant disciplines and eight years of relevant experience in nanofabrication and exposure to wafer processing and characterization in clean rooms, including experience working with standard semiconductor equipment for lithography, coating, plasma processes including deposition and etch, wet cleans, electroplating, annealing, chemical mechanical polishing, bonding, packaging, metrology and inspection.

• Goal-oriented and ability to prioritize and multitask.
• Demonstrated excellent written and verbal communication skills.
• Demonstrated ability to work successfully in a collaborative team environment.
• Ability to work effectively in a dynamic and fast paced environment.

Three years of experience in…