Senior Layout Engineer: .5D/3D IC Packaging Lead
Job in
Austin, Travis County, Texas, 78716, USA
Listed on 2026-07-25
Listing for:
Amazon Web Services (AWS)
Full Time
position Listed on 2026-07-25
Job specializations:
-
Engineering
Packaging Engineer, Electronics Engineer, Systems Engineer
Job Description & How to Apply Below
Annapurna Labs (U.S.) Inc. is seeking a senior Package Layout Engineer to lead end-to-end physical design of IC packages for next-generation ML and data-center ASICs.
You will own the package layout from floor planning through tape-out, coordinating with silicon, SI/PI, thermal, and manufacturing teams to meet performance, density, and reliability targets. You will drive advanced packaging architectures (2.5D/3D-IC, fan-out WLP) and manage cross-team design validation, DFM compliance, and
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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