Semiconductor Packaging Engineer

About fab2

The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.

fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.

As a Packaging Engineer at fab2, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc.

We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.

• Working with the team to explore and validate innovative semiconductor packaging processes.

• Conducting hands-on lab experiments end-to-end to test.

• Innovating novel materials for packaging, considering factors such as conductivity, mechanical strength, and thermal expansion.

• Evaluating the process to continuously improve performance.

• Collaborating closely with team members to provide technical support for experiments and methodologies.

• Creating thorough documentation, including Standard Operating Procedures (SOPs), and maintaining equipment to ensure optimal performance and safety.

• Masters or equivalent experience in Electrical Engineering, Material Science, Mechanical Engineering, or a related field

• 5+ years of experience in semiconductor packaging from research or industry, with a strong understanding of end-to-end packaging processes and technologies.

• Knowledge of packaging materials, thermal management, and reliability testing

• Strong analytical and problem-solving skills, with the ability to troubleshoot complex packaging issues effectively.

• Experience in 3d printing

• Experience in metal plating

• Mechanical-related background

• Knowledge of electronic design

We’re an early-stage hardware startup with solid funding, world-class advisors, and offices in Austin and San Francisco.

fab2 is committed to fair and equitable compensation practices. The annual salary range for this role is $110,000 – $155,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in fab
2.

fab2 Semi offers the following benefits, subject to applicable eligibility requirements:

• Medical, Dental, and Vision insurance

• Generous Paid Time Off inclusive of Holidays and Sick Time

• Visa Sponsorship

• Life and Disability Insurance

• Paid Parental Leave

• 401(k) retirement plan

• Weekly Learning & Development opportunities

• Commuter Benefits including Parking and Late Night Uber rides from the office

• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi