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Lead IC Package Layout Engineer (2.5D/3D
Job in
Austin, Travis County, Texas, 78716, USA
Listed on 2026-08-15
Listing for:
Amazon
Full Time
position Listed on 2026-08-15
Job specializations:
-
Engineering
Systems Engineer, Packaging Engineer
Job Description & How to Apply Below
Annapurna Labs, an AWS organization, seeks a Package Layout Design Engineer to advance physical IC packaging for ML and data center ASICs. You will drive layout tasks from floor planning through tape out, coordinating with SI/PI, thermal, and manufacturing teams to hit performance, density, and reliability goals.
You will implement 2.5D/3D-IC packaging architectures, support floorplan development, routing, and stack-up management, and ensure DFM-compliant designs with OSAT partners.
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