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Principal Engineer, Automated Derivatives

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Renesas Electronics
Full Time position
Listed on 2026-08-18
Job specializations:
  • Engineering
    AI Engineer (Applied/Software), Automation & Mechatronics Engineer
Salary/Wage Range or Industry Benchmark: 180000 - 250000 USD Yearly USD 180000.00 250000.00 YEAR
Job Description & How to Apply Below

In this multi-disciplinary role, you will lead the end-to-end delivery of derivative SoCs, focusing on intersection of RTL design, functional verification, and physical implementation. You will not just execute flows; you will build an AI-augmented "Silicon Factory" that uses machine learning to bridge the gap between architectural intent and GDSII. Your goal is to achieve ultra-fast turnaround times by using AI to predict physical outcomes during RTL coding and to automate the verification of design variants.

Key Responsibilities
1. AI-Augmented RTL & Architecture
  • Physical-Aware RTL: Use ML-based predictors to evaluate RTL code for timing and congestion bottlenecks before synthesis, reducing the number of "RTL-to-GDS" iterations.
  • Derivative Generation: Develop scripts and Generative AI prompts to automate the creation of RTL wrappers, memory maps, and bus interconnects for design variants.
  • Logic Optimization: Employ AI to identify redundant logic or clock-gating opportunities to hit aggressive power targets in derivative designs.
  • Automated Testbench Scaling: Build AI-driven verification environments that automatically adjust constraints and coverage goals when a design derivative (e.g., changed cache size or port count) is instantiated.
  • Smart Regression Management: Use ML to prioritize test cases that are most likely to fail based on historical RTL changes, slashing simulation time and compute costs.
  • Bug Prediction: Deploy pattern-recognition models to identify "bug-prone" modules in the RTL based on complexity metrics and previous tape-out data.
3. Rapid Physical Implementation
  • Seamless Handoff: Ensure a "zero-friction" path from RTL to Physical Design by using AI to automatically generate floorplan constraints and timing assertions from the design spec.
  • Closure Acceleration: Drive the physical implementation of derivatives, using AI to "reuse" placement and routing solutions from parent designs to achieve 10x faster convergence.
Job Description

In this multi-disciplinary role, you will lead the end-to-end delivery of derivative SoCs, focusing on intersection of RTL design, functional verification, and physical implementation. You will not just execute flows; you will build an AI-augmented "Silicon Factory" that uses machine learning to bridge the gap between architectural intent and GDSII. Your goal is to achieve ultra-fast turnaround times by using AI to predict physical outcomes during RTL coding and to automate the verification of design variants.

Key Responsibilities
1. AI-Augmented RTL & Architecture
  • Physical-Aware RTL: Use ML-based predictors to evaluate RTL code for timing and congestion bottlenecks before synthesis, reducing the number of "RTL-to-GDS" iterations.
  • Derivative Generation: Develop scripts and Generative AI prompts to automate the creation of RTL wrappers, memory maps, and bus interconnects for design variants.
  • Logic Optimization: Employ AI to identify redundant logic or clock-gating opportunities to hit aggressive power targets in derivative designs.
2. Intelligent Verification
  • Automated Testbench Scaling: Build AI-driven verification environments that automatically adjust constraints and coverage goals when a design derivative (e.g., changed cache size or port count) is instantiated.
  • Smart Regression Management: Use ML to prioritize test cases that are most likely to fail based on historical RTL changes, slashing simulation time and compute costs.
  • Bug Prediction: Deploy pattern-recognition models to identify "bug-prone" modules in the RTL based on complexity metrics and previous tape-out data.
3. Rapid Physical Implementation
  • Seamless Handoff: Ensure a "zero-friction" path from RTL to Physical Design by using AI to automatically generate floorplan constraints and timing assertions from the design spec.
  • Closure Acceleration: Drive the physical implementation of derivatives, using AI to "reuse" placement and routing solutions from parent designs to achieve 10x faster convergence.
Qualifications
  • Education: Minimum of a Master’s degree in Electrical Engineering, Computer Science, or Computer Engineering.
  • Experience: 12–15 years of professional experience in the semiconductor industry, with a…
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